Shinichi Miyakuni
Mitsubishi
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Publication
Featured researches published by Shinichi Miyakuni.
radio frequency integrated circuits symposium | 2002
Kazuya Yamamoto; T. Asada; Satoshi Suzuki; T. Miura; Akira Inoue; Shinichi Miyakuni; J. Otsuji; R. Hattori; Y. Miyazaki; Teruyuki Shimura
This paper describes a 3.5-V operation HBT MMIC power amplifier module for use in GSM/EDGE dual-mode, 900/1800/1900-MHz triple band handset applications. With diode switches and a band select switch built on the MMIC, the module delivers a P/sub out/ of 35.5 dBm and a PAE of about 50% for GSM900, a 33.4-dBm P/sub out/ and a 45% PAE for GSM1800/1900. While satisfying an error vector magnitude (EVM) of less than 4% and a receive-band noise power of less than -83 dBm/100 kHz, the module also delivers a 29.5 dBm P/sub out/ and a PAE of over 25% for EDGE900, a 28.5 dBm P/sub out/ and a PAE of over 25% for EDGE1800/1900.
compound semiconductor integrated circuit symposium | 2004
Tetsuo Kunii; Masahiro Totsuka; Yoshitaka Kamo; Yoshitsugu Yamamoto; Hideo Takeuchi; Yoshiham Shimada; Toshihiko Shiga; Hiroyuki Minami; Toshiaki Kitano; Shinichi Miyakuni; Shigenori Nakatsuka; Akira Inoue; Tomoki Oku; Takuma Nanjo; Toshiyuki Oishi; Takahide Ishikawa; Yoshio Matsuda
This is the first report of catalytic vapor deposition (Cat-CVD) passivated AlGaN/GaN HEMT. We have found out that the Cat-CVD passivation film with NH3 treatment greatly enhances the reliability of the AlGaN/GaN HEMT. It is rationalized, through the low frequency capacitance-voltage measurement, that the NH3 treatment in the Cat-CVD reactor before the SiN film deposition minimizes the damage at the SiN/AlGaN interface, leading to reducing the surface trap density. The AlGaN/GaN HEMT passivated by the Cat-CVD SiN film suppresses the degradation of an output power to less than 0.4 dB under the RF operation of Vd = 30 V, f = 5 GHz after 200 h.
compound semiconductor integrated circuit symposium | 2010
K. Kanaya; Hirotaka Amasuga; Shinsuke Watanabe; Yoshitsugu Yamamoto; Naoki Kosaka; Shinichi Miyakuni; Seiki Goto; Akihiro Shima
To develop a low 1/f noise and high reliability InP/GaAsSb DHBT, experimental analyses on the recombination current have been carried out. The results show that the recombination current that can affect 1/f noise and reliability originates from the surface of the base. We have optimized the ledge and passivation film on the base surface of InP/GaAsSb DHBT. The optimized DHBT offers 7 dB lower 1/f noise level than the non-optimized DHBT. Additionally, in the high temperature burn-in test, no degradation has been induced even after 1,000 hr. It can satisfy the criterion of automotive radars. The W-band oscillator with the optimized DHBT delivers a remarkably low phase noise of -107 dBc/Hz at 1MHz-offset. This phase noise is 10 dB lower than that of the non-optimized HBT oscillator. These results experimentally confirm that decreasing 1/f noise is effective for the design of a low phase noise oscillator using InP/GaAsSb DHBT. To our knowledge, this is the first report to reveal that the base surface structure of InP/GaAsSb DHBT is a key factor in the improvement of reliability and phase noise.
Archive | 1997
Tomoki Oku; Naohito Yoshida; Shinichi Miyakuni; Toshihiko Shiga
Archive | 2001
Taisei Hirayama; Koichiro Ito; Ryo Hattori; Yoshitsugu Yamamoto; Yoshihiro Notani; Shinichi Miyakuni
Archive | 1997
Shinichi Miyakuni
Archive | 1996
Shinichi Miyakuni
Archive | 1993
Shinichi Miyakuni; Takesi Kuragaki
Archive | 1996
Tomoki Oku; Hirofumi Nakano; Shinichi Miyakuni; Teruyuki Shimura; Ryo Hattori
Archive | 1997
Shinichi Miyakuni; Teruyuki Shimura