Siew Yee Lim

Uncertainty analysis for the coefficient of band-to-band absorption of crystalline silicon

We analyze the uncertainty of the coefficient of band-to-band absorption of crystalline silicon. For this purpose, we determine the absorption coefficient at room temperature (295 K) in the wavelength range from 250 to 1450 nm using four different measurement methods. The data presented in this work derive from spectroscopic ellipsometry, measurements of reflectance and transmittance, spectrally resolved luminescence measurements and spectral responsivity measurements. A systematic measurement uncertainty analysis based on the Guide to the expression of uncertainty in measurement (GUM) as well as an extensive characterization of the measurement setups are carried out for all methods. We determine relative uncertainties of the absorption coefficient of 0.4% at 250 nm, 11% at 600 nm, 1.4% at 1000 nm, 12% at 1200 nm and 180% at 1450 nm. The data are consolidated by intercomparison of results obtained at different institutions and using different measurement approaches.

Boron-oxygen defect imaging in p-type Czochralski silicon

This work was supported by the Australian Research Council (ARC) Future Fellowships program and the Australian Renewable Energy Agency (ARENA) fellowships program.

Dopant concentration imaging in crystalline silicon wafers by band-to-band photoluminescence

In this work, we present two techniques for spatially resolved determination of the dopant density in silicon wafers. The first technique is based on measuring the formation rate of iron-acceptor pairs, which is monitored by band-to-band photoluminescence in low injection. This method provides absolute boron concentration images on p-type wafers, even if compensating dopants such as phosphorus are present, without reference to other techniques. The second technique is based on photoluminescence images of unpassivated wafers, where the excess carrier concentration is pinned by a high surface recombination rate. This rapid technique is applicable to either p- or n-type wafers, when the bulk carrier lifetime is much longer than the transit time to the surface. The relative sensitivities and advantages of the two techniques are discussed.

Applications of Photoluminescence Imaging to Dopant and Carrier Concentration Measurements of Silicon Wafers

Photoluminescence-based imaging is most commonly used to measure the excess minority carrier density and its corresponding lifetime. By using appropriate surface treatments, this high-resolution imaging technique can also be used for majority carrier concentration determination. The mechanism involves effectively pinning the minority excess carrier density, resulting in a dependence of the photoluminescence intensity on only the majority carrier density. Three suitable surface preparation methods are introduced in this paper: aluminum sputtering, deionized water etching, and mechanical abrasion. Spatially resolved dopant density images determined using this technique are consistent with the images obtained by a well-established technique based on free carrier infrared emission. Three applications of the technique are also presented in this paper, which include imaging of oxygen-related thermal donors, radial dopant density analysis, and the study of donor-related recombination active defects. These applications demonstrate the usefulness of the technique in characterizing silicon materials for photovoltaics.

Dopant Concentration Imaging in Crystalline Silicon Wafers by Band-To-Band Photoluminescence

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