Sören Dhoore

Expanding the Silicon Photonics Portfolio With Silicon Nitride Photonic Integrated Circuits

The high index contrast silicon-on-insulator platform is the dominant CMOS compatible platform for photonic integration. The successful use of silicon photonic chips in optical communication applications has now paved the way for new areas where photonic chips can be applied. It is already emerging as a competing technology for sensing and spectroscopic applications. This increasing range of applications for silicon photonics instigates an interest in exploring new materials, as silicon-on-insulator has some drawbacks for these emerging applications, e.g., silicon is not transparent in the visible wavelength range. Silicon nitride is an alternate material platform. It has moderately high index contrast, and like silicon-on-insulator, it uses CMOS processes to manufacture photonic integrated circuits. In this paper, the advantages and challenges associated with these two material platforms are discussed. The case of dispersive spectrometers, which are widely used in various silicon photonic applications, is presented for these two material platforms.

Demonstration of a discretely tunable III-V-on-silicon sampled grating DFB laser

We demonstrate discrete wavelength tuning with a heterogeneously integrated III-V-on-silicon sampled grating distributed feedback laser. With only two injection currents, the laser is tunable over a wavelength range larger than 55 nm in wavelength steps of 5 nm. A maximum waveguide-coupled output power of 15 dBm is obtained as well as a high side mode suppression of more than 33 dB for all wavelength channels.

Novel adiabatic tapered couplers for active III-V/SOI devices fabricated through transfer printing.

We present the design of two novel adiabatic tapered coupling structures that allow efficient and alignment tolerant mode conversion between a III-V membrane waveguide and a single-mode SOI waveguide in active heterogeneously integrated devices. Both proposed couplers employ a broad intermediate waveguide to facilitate highly alignment tolerant coupling. This robustness is needed to comply with the current misalignment tolerance requirements for high-throughput transfer printing. The proposed coupling structures are expected to pave the way for transfer-printing-based heterogeneous integration of active III-V devices such as semiconductor optical amplifiers (SOAs), photodetectors, electro-absorption modulators (EAMs) and single wavelength lasers on silicon photonic integrated circuits.