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Featured researches published by Tadakazu Takada.


IEEE Transactions on Electron Devices | 1991

Analysis of highly doped collector transistors by using two-dimensional process/device simulation and its application of ECL circuits

Hiroshi Goto; Yoji Nagase; Tadakazu Takada; Akinori Tahara; Yoshinobu Momma

A report is presented of the results of an investigation of device parameters and collector-to-emitter breakdown voltages of double polysilicon self-aligned transistors with highly doped collectors using a two-dimensional process/device simulation system. Favourable phosphorous-ion implanting condition for a highly doped pedestal collector was found to achieve a high cutoff frequency as well as low AC base resistance and small base-collector capacitance, thereby keeping the minimum collector-to-emitter breakdown voltage of 3 V. The authors also report ECL circuit performance improvements achieved in experiments that realized a minimum ECL gate delay time of 26.3 ps/gate at switching current of 1.64 mA as a result of process optimization. Moreover, a 1/8 static frequency divider T-F/F has been observed to operate up to a maximum frequency of 15.8 GHz. >


Archive | 1980

Dry etching of metal film

Tadakazu Takada; Kazuo Tokitomo; Hitoshi Hoshino


Archive | 1984

Process for fabricating a wiring layer of aluminum or aluminum alloy on semiconductor devices

Tadakazu Takada; Katsunori C O Fujitsu Shimizu


Archive | 1984

Etching method for semiconductor devices

Tadakazu Takada


Archive | 1980

Method of manufacturing a semiconductor device having a patterned multi-layer structure

Kenji Sugishima; Tadakazu Takada


Archive | 1985

Process for producing an interconnection structure of a semiconductor device

Takahiro Tuchiya; Kazuaki Room Fujitsu-Aobasai-Ryo Tukuda; Tadakazu Takada; Hiroshi Goto


symposium on vlsi technology | 1985

A New Isolation Technology for Bipolar VLSI Logic (IOP-L)

Hiroshi Goto; Tadakazu Takada; Kazumasa Nawata; Yasunori Kanai


Archive | 1984

A method of etching for use in semiconductor device fabrication

Tadakazu Takada


Electronics and Communications in Japan Part Ii-electronics | 1990

4 Gbit/s optical receiver IC's using high‐speed bipolar process “ESPER”

Tatsuya Deguchi; Akinori Tahara; Tadakazu Takada; Hiroshi Hamano


Archive | 1985

Verfahren zum herstellen einer verbindungsstruktur von einer halbleiteranordnung. A method of manufacturing an interconnection structure of a semiconductor device.

Takahiro Tuchiya; Kazuaki Room Fujitsu-Ao Tukuda; Tadakazu Takada; Hiroshi Goto

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