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Publication


Featured researches published by Takafumi Sakurada.


MRS Proceedings | 2007

Newly Developed Abrasive-free Copper CMP Slurry Based on Electrochemical Analysis

Jin Amanokura; Katsumi Mabuchi; Takafumi Sakurada; Yutaka Nomura; Masanobu Habiro; Haruo Akahoshi

In order to reduce microscratches and obtain minimized dishing and erosion, we have developed new abrasive-free Cu CMP slurries. During the development of these slurries, some electrochemical examination was performed. The most effective knowledge was obtained through the analysis using rotary Cu disk electrode under pressure. On the basis of these studies, new abrasive-free Cu CMP slurries with a high removal rate and excellent planarity were designed and developed. The mechanism of reducing dishing and erosion was also discussed.


Archive | 2011

Cmp polishing solution and polishing method

Kouji Mishima; Takafumi Sakurada; Tomokazu Shimada


Archive | 2007

Polishing slurry for cmp and polishing method

Takashi Shinoda; Shigeru Nobe; Takafumi Sakurada; Yoshikazu Oomori; Tadahiro Kimura


Archive | 2006

POLISHING SOLUTION FOR CMP AND METHOD OF POLISHING

Takashi Shinoda; Shigeru Nobe; Takafumi Sakurada; Yoshikazu Oomori; Tadahiro Kimura


Archive | 2006

Metal polishing liquid and method for polishing film to be polished

Yutaka Nomura; Hiroshi Nakagawa; Sou Anzai; Fumiko Tobita; Takafumi Sakurada; Katsumi Mabuchi


Archive | 2013

Polishing slurry for metal films and polishing method

Takaaki Tanaka; Masato Fukasawa; Shigeru Nobe; Takafumi Sakurada; Takashi Shinoda


Archive | 2007

Polishing liquid for cmp

Shigeru Nobe; Takashi Shinoda; Takafumi Sakurada; Takaaki Tanaka; Yoshikazu Oomori; Tadahiro Kimura; Masato Fukasawa


Archive | 2007

Method of Producing Oxide Particles, Slurry, Polishing Slurry, and Mehod of Polishing Substrate

Takafumi Sakurada; Daisuke Hosaka; Kanshi Chinone


Archive | 2007

Method for producing oxide particle, slurry, polishing agent and method for polishing substrate

Takafumi Sakurada; Daisuke Hosaka; Kanshi Chinone


Archive | 2006

Abrasive-free polishing slurry and CMP process

Katsumi Mabuchi; Haruo Akahoshi; Masanobu Habiro; Takafumi Sakurada; Yutaka Nomura

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