Takashi Ajima

Semiconductor device having a multilayer wiring structure using a polyimide resin

Method for forming metallization structure having flat surface on semiconductor substrate

Semiconductor device with silicon carbide-glass-silicon carbide passivating overcoat

Semiconductor device of multilayer wiring structure

Semiconductor device with an improved bonding section

Method of manufacturing a semiconductor device using silicon carbide mask

Semiconductor device having insulating layer including polyimide film

Method of producing a P-N junction utilizing polycrystalline silicon

Semiconductor device with compact isolation and method of making the same

Method of manufacturing a semiconductor device using epitaxially regrown protrusion as an alignment marker