Takayuki Matsuzaki | Researchain

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Archive | 2011

Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device

Teiichi Inada; Keiji Sumiya; Takeo Tomiyama; Tetsurou Iwakura; Hiroyuki Kawakami; Masao Suzuki; Takayuki Matsuzaki; Youichi Hosokawa; Keiichi Hatakeyama; Yasushi Shimada; Yuuko Tanaka; Hiroyuki Kuriya

Archive | 2001

Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device

Inada Teiichi; Keiji Sumiya; Takeo Tomiyama; Tetsurou Iwakura; Hiroyuki Kawakami; Masao Suzuki; Takayuki Matsuzaki; Youichi Hosokawa; Keiichi Hatakeyama; Yasushi Shimada; Yuuko Tanaka; Hiroyuki Kuriya

Archive | 2005

Adhesive sheet, method for producing the sheet, method for producing semiconductor device, and the semiconductor device

Suzushi Furuya; Teiichi Inada; Maiko Kaneda; Michio Masuno; Takayuki Matsuzaki; Michio Uruno; 涼士古谷; 道夫増野; 道生宇留野; 隆行松崎; 禎一稲田; 麻衣子金田

Archive | 2011

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

Maikoi Tanaka; Michio Uruno; Takayuki Matsuzaki; Ryoji Furutani; Michio Mashino; Teiichi Inada

Archive | 2004

Adhesive sheet, semiconductor device and method for producing the same

Suzushi Furuya; Maiko Kaneda; Hiroyuki Kawakami; Hiroshi Kirihara; Michio Masuno; Takayuki Matsuzaki; Michio Uruno; 涼士古谷; 道夫増野; 道生宇留野; 広幸川上; 隆行松崎; 博桐原; 麻衣子金田

Archive | 2003

Dicing die bond sheet

Suzushi Furuya; Teiichi Inada; Maiko Kaneda; Michio Masuno; Takayuki Matsuzaki; Keisuke Okubo; Michio Uruno; 涼士古谷; 道夫増野; 恵介大久保; 道生宇留野; 隆行松崎; 禎一稲田; 麻衣子金田

Archive | 2005