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Featured researches published by Takeo Tomiyama.


Applied Optics | 1995

Rewritable optical-disk fabrication with an optical recording material made of naphthalocyanine and polythiophene

Takeo Tomiyama; Itsuo Watanabe; Atsushi Kuwano; Masanobu Habiro; Nobuaki Takane; Mitsuo Yamada

A novel rewritable optical disk that uses an optical recording material made of naphthalocyanine and polythiophene as the recording layer is described. In this system the complex refractive index of the recording material changes reversibly, depending on the aggregation states of naphthalocyanine induced by a conformation change of the polythiophene matrix. After recording, the imaginary part of the refractive index of the recording material increases to three times that of the unrecorded part, at a wavelength of 790 nm at which a semiconductor laser emits light. The fabricated polythiophene naphthalocyanine optical disk shows a high reflectivity of 58% and a large readout modulation amplitude (I(11)/I(top)) of 0.63. It is confirmed that the polythiophene/naphthalocyanine optical disk can be played back on conventional compact-disc players even after ten cycles of rewriting.


electronics packaging technology conference | 2000

Material system for high performance DRAM-CSP

Yoshihiro Nomura; Takeo Tomiyama; T. Tanaka; T.-I. Inada; Keiji Sumiya

The /spl mu/BGA/sup (R)/ which Tessera Inc. developed is one of the most suitable chip scale packages (CSP) for high speed DRAMs. However, the larger the chip size, the harder it is to achieve high levels of package reliability. Based on the thermal stress analysis, we have determined the threshold values of elastic modulus and coefficient of thermal expansion (CTE) of both the adhesive film and the liquid encapsulant to achieve higher thermal cyclic properties. Through this study, we have developed new polymer alloys composed of a low modulus polymer and an epoxy resin. CSPs fabricated with the newly developed materials showed high reliability including thermal cyclic properties and solder reflow resistance at high temperature under Pb-free requirements.


Archive | 2011

Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device

Teiichi Inada; Keiji Sumiya; Takeo Tomiyama; Tetsurou Iwakura; Hiroyuki Kawakami; Masao Suzuki; Takayuki Matsuzaki; Youichi Hosokawa; Keiichi Hatakeyama; Yasushi Shimada; Yuuko Tanaka; Hiroyuki Kuriya


Archive | 1997

Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film

Kazunori Yamamoto; Yasushi Shimada; Yasushi Kumashiro; Teiichi Inada; Hiroyuki Kuriya; Aizou Kaneda; Takeo Tomiyama; Yoshihiro Nomura; Yoichi Hosokawa; Hiroshi Kirihara; Akira Kageyama


Archive | 2001

Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device

Inada Teiichi; Keiji Sumiya; Takeo Tomiyama; Tetsurou Iwakura; Hiroyuki Kawakami; Masao Suzuki; Takayuki Matsuzaki; Youichi Hosokawa; Keiichi Hatakeyama; Yasushi Shimada; Yuuko Tanaka; Hiroyuki Kuriya


Archive | 1997

Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

Kazunori Yamamoto; Yasushi Shimada; Yasushi Kumashiro; Teiichi Inada; Hiroyuki Kuriya; Aizou Kaneda; Takeo Tomiyama; Yoshihiro Nomura; Yoichi Hosokawa; Hiroshi Kirihara; Akira Kageyama


Archive | 2001

Adhesive film and its use and method for producing semiconductor device

Keiichi Hatakeyama; Teiichi Inada; Takayuki Matsuzaki; Takeo Tomiyama; Michio Uruno; Masaaki Yasuda; 道生 宇留野; 雅昭 安田; 健男 富山; 隆行 松崎; 恵一 畠山; 禎一 稲田


Archive | 2000

ADHESIVE FILM, WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE PROVIDED WITH ADHESIVE FILM AND METHOD FOR FABRICATING THEM

Yuji Hasegawa; Teiichi Inada; Masaya Nishiyama; Takeo Tomiyama; 健男 富山; 禎一 稲田; 雅也 西山; 雄二 長谷川


Archive | 2006

RESIN COMPOSITION AND OPTICAL MEMBER FORMED FROM THE SAME

Takeo Tomiyama; Syouko Tanaka; Akihiro Yoshida; Shingo Kobayashi


Archive | 2007

Epoxy resin curing agent, epoxy resin composition, epoxy resin cured product and optical member using the same

Minoru Suzuki; Ryusuke Tanaka; Takeo Tomiyama; Akihiro Yoshida; 明弘 吉田; 健男 富山; 龍介 田中; 実 鈴木

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