Yasushi Shimada

High-Frequency Properties of Embedded Passives and Thermal Resistance in Organic Substrates for RF Module

Radio Frequency (RF) modules have been miniaturized to meet the demand for smaller and more enhanced handsets for wireless applications such as cellular phones. However, area for passive devices used in RF modules has made further miniaturization difficult. Passives embedded in substrates are now being studied intensively. In addition, circuit simulation technology has been developed that enables efficient designing of RF module circuits. Circuit designers, however, have limited database of organic substrates and embedded passives. Further, optimized thermal designs are required to prevent thermal resistance increase due to miniaturization of substrates. In this paper, we describe the high-frequency properties of the capacitors embedded in the organic substrates and present the equivalent circuit models of the embedded capacitors. We also present the thermal design of organic substrates applicable to RF modules.