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Dive into the research topics where Timothy C. Krywanczyk is active.

Publication


Featured researches published by Timothy C. Krywanczyk.


Archive | 1997

Off-center grooved polish pad for CMP

Timothy C. Krywanczyk; Douglas Keith Sturtevant; Matthew T. Tiersch


Archive | 1996

Method of controlling stress in a film

Donald W. Brouillette; Timothy C. Krywanczyk; Jerome B. Lasky; Rick L. Mohler; Wolfgang Otto Rauscher


Archive | 2008

Method of thinning a semiconductor substrate

Steven R. Codding; Timothy C. Krywanczyk; Timothy E. Neary; Edmund J. Sprogis


Archive | 2001

Chemical mechanical polishing slurry and method for polishing metal/oxide layers

Paul M. Feeney; Timothy C. Krywanczyk; Lawrence Daniel David; Matthew T. Tiersch; Eric J. White


Archive | 2004

Use of photoresist in substrate vias during backside grind

Donald W. Brouillette; Joseph D. Danaher; Timothy C. Krywanczyk; Amye L. Wells


Archive | 1999

Method for reworking copper metallurgy in semiconductor devices

Thomas F. Curran; Timothy C. Krywanczyk; Michael S. Lube; Matthew D. Moon; Rock Nadeau; Clark D. Reynolds; Dean Allen Schaffer; Joel M. Sharrow; Paul H. Smith; David C. Thomas; Eric J. White; Kenneth H. Yao


Archive | 2008

Rework process for removing residual uv adhesive from c4 wafer surfaces

Steven R. Codding; Timothy C. Krywanczyk; Edmund J. Sprogis; Jocelyn Sylvestre; Matthew R. Whalen


Archive | 1997

Chemical mechanical polishing slurry for tungsten

Timothy C. Krywanczyk; Lawrence Daniel David


Archive | 2003

Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operations

Robert R Cadieux; Scott A. Estes; Timothy C. Krywanczyk


Archive | 2000

Method to prevent leaving residual metal in CMP process of metal interconnect

Jose L. Cruz; Cuc K. Huynh; Timothy C. Krywanczyk; Douglas Keith Sturtevant

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