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Archive | 2004

POLYURETHANE IMIDE RESIN AND ADHESIVE COMPOSITION USING THIS

Tomohiro Hirata; Minoru Sugiura; Masami Yusa; 知広 平田; 実 杉浦; 正己 湯佐


Archive | 2000

Polyimide resin composition and file-forming material

Tomohiro Hirata; Katsuhiro Onose; 勝博 小野瀬; 知広 平田


Archive | 2001

Polyamideimide resin paste and coating material comprising the same

Tomohiro Hirata; Susumu Kaneko; Katsuhiro Onose; 勝博 小野瀬; 知広 平田; 進 金子


Archive | 1997

RESIN PASTE, FORMATION OF FILM, ELECTRONIC PART AND SEMICONDUCTOR DEVICE

Keizo Hirai; Tomohiro Hirata; Hiroshi Nishizawa; Toichi Sakata; 淘一 坂田; 圭三 平井; 知広 平田; ▲広▼ 西澤


Archive | 2010

THERMOSETTING RESIN COMPOSITION, METHOD FOR FORMING PROTECTIVE FILM FOR FLEXIBLE WIRING BOARD, AND FLEXIBLE WIRING BOARD

Iori Hukushima; Tomohiro Hirata; Hidekazu Kondou; Susumu Kaneko; Satoshi Uehara; Yuki Miyamoto


Archive | 2006

Resin composition for sealing filler, flip chip mounting method using same, and flip chip mounted article

Osamu Matsuzaka; Katsuhiko Yasu; Tomohiro Hirata; Takenori Ookubo


Archive | 2003

POLYIMIDE RESIN COMPOSITION, FILM-FORMING MATERIAL AND ELECTRONIC PART USING THE SAME

Tomohiro Hirata; 知広 平田


Archive | 2001

Resin composition and film forming material thereof

Tomohiro Hirata; Susumu Kaneko; Katsuhiro Onose; 勝博 小野瀬; 知広 平田; 進 金子


Archive | 1998

POLYAMIDEIMIDE RESIN PASTE AND FILM-FORMING MATERIAL

Tomohiro Hirata; Toshiichi Okawara; Katsuhiro Onose; 敏一 大川原; 勝博 小野瀬; 知広 平田


Archive | 2002

Paste of thermosetting resin and flexible printed circuit board using the same

Tomohiro Hirata; Susumu Kaneko; Katsuhiro Onose; 小野瀬 勝博; 平田 知広; 金子 進

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