Umesh Kelkar

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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems | 2005

Umesh Kelkar; Arvind Sundarrajan; Tza-Jing Gung; Ned Hammond; Ajay Bhatnagar; Xinyu Fu; Mark A. Perrin; John C. Forster; Prabu Gopalraja; Jianming Fu

A new physical vapor deposition source is developed to meet the challenges of barrier deposition for sub 100nm devices. The source employs multi-step process to deposit thin, conformal and uniform barrier films. This paper describes reactor scale modeling and simulation of deposition and etching plasmas used for barrier deposition. The modeling and simulation in tandem with experimental data demonstrate that the chamber can be used to independently control the particle fluxes as per the requirements of the deposition and etching steps. The simulation results were qualitatively used to optimize the ion flux uniformity by altering the magnetic fields near the wafer.© 2005 ASME

Archive | 2002

Praburam Gopalraja; Jianming Fu; Xianmin Tang; John C. Forster; Umesh Kelkar

Archive | 2000

Semyon Sherstinsky; Alison Gilliam; Paul Smith; Leonel A. Zuniga; Ted Yoshidome; Nitin Khurana; Rod Mosely; Umesh Kelkar; Joseph Yudovsky; Alan Popiolkowski

Archive | 2004

Praburam Gopalraja; Xianmin Tang; Jianming Fu; Mark A. Perrin; Jean Yue Phillip Wang; Arvind Sundarrajan; Hong Zhang; Jick M. Yu; Umesh Kelkar; Zheng Xu; Fusen Chen

Archive | 2001