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Vijay Subramanian

Intel

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Publication

Featured researches published by Vijay Subramanian.

Journal of Electronic Packaging | 2017

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Vijay Subramanian; Kyle Yazzie; Tsgereda Alazar; Bharat Penmecha; Pilin Liu; Yiqun Bai; Pramod Malatkar

ASME 2016 International Mechanical Engineering Congress and Exposition | 2016

Mechanical Testing for Stretchable Electronics

Steven A. Klein; Aleksandar Aleksov; Vijay Subramanian; Rajendra C. Dias; Pramod Malatkar; Ravi Mahajan

electronic components and technology conference | 2018

Understanding Underfill Degradation in Reliability Testing Conditions for ADAS Package Development

Ziyin Lin; Vijay Subramanian; Pramod Malatkar; Nisha Ananthakrishnan

Archive | 2017

REMOVABLE IC PACKAGE STIFFENER

Steven A. Klein; Aditya S. Vaidya; Vijay Subramanian; Santosh Sankarasubramanian; Pramod Malatkar; Suriyakala Ramalingam; Ashish Dhall

Archive | 2017

Membrane test for Mechanical Testing of Stretchable Electronics

Ravindranath V. Mahajan; Rajendra C. Dias; Pramod Malatkar; Steven A. Klein; Vijay Subramanian; Aleksandar Aleksov; Robert L. Sankman

Archive | 2017

LATERAL EXPANSION APPARATUS FOR MECHANICAL TESTING OF STRETCHABLE ELECTRONICS

Vijay Subramanian; Steven A. Klein; Rajendra C. Dias; Pramod Malatkar; Aleksandar Aleksov; Ravindranath V. Mahajan; Robert L. Sankman

Archive | 2017

APPAREIL D'EXPANSION LATÉRALE POUR TEST MÉCANIQUE DE DISPOSITIFS ÉLECTRONIQUES ÉTIRABLES

Vijay Subramanian; Steven A. Klein; Rajendra C. Dias; Pramod Malatkar; Aleksandar Aleksov; Ravindranath V. Mahajan; Robert L. Sankman

Journal of Electronic Packaging | 2017

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian; Jaime Cruz; Kyle Yazzie; Vaasavi Sundar; Vijay Subramanian; Tsgereda Alazar; Sivakumar Yagnamurthy; Edvin Cetegen; David McCoy; Pramod Malatkar

ASME 2016 International Mechanical Engineering Congress and Exposition | 2016

High Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian; Jaime Cruz; Kyle Yazzie; Vaasavi Sundar; Vijay Subramanian; Edvin Cetegen; David McCoy; Pramod Malatkar

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Collaboration

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Pramod Malatkar

Intel

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Steven A. Klein

Arizona State University

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Aleksandar Aleksov

Intel

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Rajendra C. Dias

Intel

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Kyle Yazzie

Intel

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Ravindranath V. Mahajan

Intel

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Robert L. Sankman

Intel

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Santosh Sankarasubramanian

Intel

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David McCoy

Intel

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Edvin Cetegen

Intel

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