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Dive into the research topics where Rajendra C. Dias is active.

Publication


Featured researches published by Rajendra C. Dias.


Archive | 2004

Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices

Rajendra C. Dias; Biju Chandran


Archive | 2013

UNDERFILL MATERIAL FLOW CONTROL FOR REDUCED DIE-TO-DIE SPACING IN SEMICONDUCTOR PACKAGES

Omkar G. Karhade; Nitin Deshpande; Rajendra C. Dias; Edvin Cetegen; Lars D. Skoglund


Archive | 2013

Ablation method and recipe for wafer level underfill material patterning and removal

Rajendra C. Dias; Lars D. Skoglund; Anil R. Indluru; Edward R. Prack; Danish Faruqui; Tyler N. Osborn; Amram Eitan; Timothy Gosselin


Archive | 2012

Reduction of underfill filler settling in integrated circuit packages

Suriyakala Ramalingam; Manish Dubey; Hsin-Yu Li; Michelle S. Phen; Hitesh Arora; Nisha Ananthakrishnan; Yiqun Bai; Yonghao Xiu; Rajendra C. Dias


Archive | 2006

Electro-optic time domain reflectometry

Zhiyong Wang; Rajendra C. Dias; Deepak Goyal


Archive | 2017

PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR DEVICE AND COMPONENTS

Rajendra C. Dias; Joshua D. Heppner; Mitul Modi; Anna M. Prakash


Archive | 2017

SEMICONDUCTOR PACKAGE WITH TRENCHED MOLDING-BASED ELECTROMAGNETIC INTERFERENCE SHIELDING

Rajendra C. Dias; Eric J. Li; Joshua D. Heppner


Archive | 2017

SEMICONDUCTOR PACKAGE HAVING AN EMI SHIELDING LAYER

Anna M. Prakash; Reynaldo Olmedo; Venmathy Mcmahan; Rajendra C. Dias; Joshua D. Heppner; Ann Jinyan Xu; Sriya Sanyal; Eric J. Li


Archive | 2017

GRADIENT ENCAPSULANT PROTECTION OF DEVICES IN STRETCHABLE ELECTRONICS

Rajendra C. Dias; Manish Dubey; Tatyana N. Andryushchenko; Aleksandar Aleksov; David W. Staines


Archive | 2017

Electromagnetically shielded electronic devices and related systems and methods

Rajendra C. Dias; Takashi Kumamoto; Yoshishiro Tomita; Mitul Modi; Joshua D. Heppner; Eric Q. Li

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