Vlasta Brusic Kaufman

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Archive | 1997

Chemical mechanical polishing slurry useful for copper substrates

Vlasta Brusic Kaufman; Rodney C. Kistler

Archive | 1999

Chemical mechanical polishing slurry useful for copper/tantalum substrates

Vlasta Brusic Kaufman; Rodney C. Kistler; Shumin Wang

Archive | 1997

Multi-oxidizer slurry for chemical mechanical polishing

Vlasta Brusic Kaufman; Shumin Wang

Archive | 1997

Chemical mechanical polishing slurry for metal layers and films

Debra Lynn Scherber; Vlasta Brusic Kaufman; Rodney C. Kistler; Brian L. Mueller; Christopher C. Streinz

Archive | 1999

Chemical mechanical polishing method useful for copper substrates

Vlasta Brusic Kaufman; Rodney C. Kistler

Archive | 1997

Multi-oxidizer precursor for chemical mechanical polishing

Vlasta Brusic Kaufman; Shumin Wang

Archive | 2007

Chemical/mechanical polishing slurry useful for copper substrate

Vlasta Brusic Kaufman; Rodney C. Kistler; Shumin Wang; カウフマン，ブラスタブラシック; シー．キストラー，ロドニー; ワン，シュミン

Archive | 1997

Slurry for chemical and mechanical polishing used for metal layer and film

Vlasta Brusic Kaufman; Rodney C. Kistler; Brian L. Mueller; Debra Lynn Scherber; Christopher C. Streinz; シー．ストレンツクリストファー; エル．シェーバーデブラ; エル．ミュラーブライアン; ブルジクカウフマンブラスタ; シー．キストラーロドニー

Archive | 1997

Chemical mechanical polishing copper substrates

Vlasta Brusic Kaufman; Rodney C. Kistler; Shumin Wang

Archive | 2009

CHEMICAL MECHANICAL POLISHING SYSTEM WITH STOPPING COMPOUND AND METHOD OF USING THE SAME

Isaac K. Cherian; Steven Grumbine; Vlasta Brusic Kaufman; Shumin Wang; Renjie Zhou; ケー．グランバインスティーブン; ケー．ケリアン，アイザック; チョウ，レンジエ; カウフマン，ブラスタブラシック; ワン，シュミン

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