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Dive into the research topics where Wai Mon Ma is active.

Publication


Featured researches published by Wai Mon Ma.


Archive | 1997

High melting point solder ball coated with a low melting point solder

Brian D. Chapman; James J. Petrone; Wai Mon Ma


Archive | 2005

Structure for repairing or modifying surface connections on circuit boards

Bruce J. Chamberlin; Mark Kenneth Hoffmeyer; Wai Mon Ma; Arch Nuttall; James R. Stack


Archive | 1998

Method and apparatus for reworking ceramic ball grid array or ceramic column grid array on circuit cards

Wai Mon Ma; James J. Petrone


Archive | 1997

Method of making a high melting point solder ball coated with a low melting point solder

Brian D. Chapman; James J. Petrone; Wai Mon Ma


Archive | 1997

Method for establishing electrical communication between a first object having a solder ball and a second object

Brian D. Chapman; James J. Petrone; Wai Mon Ma


Archive | 2005

ENHANCED HEAT SYSTEM FOR BGA/CGA REWORK

Raymond D. Birchall; Brian D. Chapman; Wai Mon Ma; James J. Petrone; Nandakumar N. Ranadive


Archive | 2004

METHOD AND STRUCTURE FOR HEAT SINK ATTACHMENT IN SEMICONDUCTOR DEVICE PACKAGING

Roger Lam; Wai Mon Ma; Vincent L. Montalbano; Arch Nuttall; Nandu N. Ranadive


Archive | 2001

TERMINATING FLOATING SIGNALS ON A BGA MODULE TO A GROUND PLANE ON A BALL GRID ARRAY (BGA) CIRCUIT BOARD SITE

Brian D. Chapman; Wai Mon Ma


Archive | 2003

INCLINED SOLDER WAVE METHODOLOGY FOR WAVE SOLDERING DOUBLE SIDED PIN-IN-HOLE ELECTRONIC COMPONENTS

Todd H. Buley; Brian N. Chapman; Roger Lam; Wai Mon Ma; John P. Weir


Archive | 2012

Adapter For Plated Through Hole Mounting Of Surface Mount Component

Daniel J. Buschel; Wai Mon Ma; James Edward Tersigni; Raymond D. Birchall

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