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Dive into the research topics where William D. Bonivert is active.

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Journal of Micromechanics and Microengineering | 1996

Masks for high aspect ratio x-ray lithography

Chantal Khan Malek; Keith H. Jackson; William D. Bonivert; Jill M. Hruby

The requirements for deep x-ray lithography (DXRL) masks are reviewed and a recently developed cost effective mask fabrication process is described. The review includes a summary of tabulated properties for materials used in the fabrication of DXRL masks. X-ray transparency and mask contrast are calculated for material combinations using simulations of exposure at the Advanced Light Source (ALS) at Berkeley, and compared to the requirements for standard x-ray lithography (XRL) mask technology. Guided by the requirements, a cost-effective fabrication process for manufacturing high contrast masks for DXRL has been developed. Thick absorber patterns () on a thin silicon wafer (m) were made using contact printing in thick positive (Hoechst 4620) and negative (OCG 7020) photoresist and subsequent gold electrodeposition. Gold was deposited using a commercially available gold sulphite bath with low current density and good agitation. The resultant gold films were fine-grained and stress-free. Replication of such masks into thick acrylic sheets was performed at the ALS.


Proceedings of SPIE | 1998

Transport limitations in electrodeposition for LIGA microdevice fabrication

Stewart K. Griffiths; Robert H. Nilson; R.W. Bradshaw; A. Ting; William D. Bonivert; John T. Hachman; Jill M. Hruby

To better understand and to help optimize the electroforming portion of the LIGA process, we have developed one and two- dimensional numerical models describing electrodeposition of metal into high aspect-ratio molds. The one-dimensional model addresses dissociation, diffusion, electromigration, and deposition of multiple ion species. The two-dimensional model is limited to a single species, but includes transport induced by forced flow of electrolyte outside the mold and by buoyancy associated with metal ion depletion within the mold. To guide model development and to validate these models, we have also conducted a series of laboratory experiments using a sulfamate bath to deposit nickel in cylindrical molds having aspect ratios up to twenty-five. The experimental results indicate that current densities well in excess of diffusion-limited currents may still yield acceptable morphologies in the deposited metal. However, the numerical models demonstrate that such large ion fluxes cannot be sustained by convection within the mold resulting from flow across the mold top. Instead, calculations suggest that the observed hundred-fold enhancement of transport probably results from natural convection within the molds and that buoyancy-driven flows may be critical to metal ion transport even in micron-scale features having very large aspect ratios. Taking advantage of this enhanced ion transport may allow order-of-magnitude reductions in electroforming times for LIGA microdevice fabrication.


Micromachining and microfabrication process technology. Conference | 1999

LIGA: metals, plastics, and ceramics

Jill M. Hruby; Stewart K. Griffiths; Linda A. Domeier; Alfredo M. Morales; Dale R. Boehme; Michelle A. Bankert; William D. Bonivert; John T. Hachman; Dawn M. Skala; A. Ting

LIGA, an acronym from the German words for Lithography, Electroforming, and Molding, is being evaluated worldwide as a method to produce microparts from engineering materials. Much of the work to date in LIGA has focused on producing metal microparts, with nickel as the most common material of choice. There is a growing interest in producing plastic parts replicated from LIGA metal masters due largely to microanalytical instrumentation and medical applications. These plastic replicates are generally made by either hot embossing or injection molding. Ceramic replication, of particular interest for high temperature applications or to produce piezoelectric or magnetic microparts, is also emerging as an area of interest. In this paper, a model of the LIGA exposure and development processes is presented along with the result of numerical optimization of mask design and process cost. The baseline processes for a cost- effective method to produce metal microparts are discussed, along with replication methods and result for plastics and ceramics.


Journal of Vacuum Science & Technology B | 1994

Deep etch x-ray lithography at the Advanced Light Source: First results

Chantal Khan Malek; Keith Jackson; Reid A. Brennen; Michael H. Hecht; William D. Bonivert; Jill M. Hruby

Deep etch x‐ray lithography permits the manufacture of very accurate high‐aspect‐ratio microstructures, which can be used as master templates for subsequent replication by electroforming and/or molding processes. This allows for mass production of three‐dimensional microstructures in a variety of materials. In this article we report on the first results using x rays from the Advanced Light Source (ALS) at the Lawrence Berkeley Laboratory, as well as on the processing and technology developed to produce high‐aspect‐ratio microstructures. The first masks used were simple stencil masks chemically or laser etched in thick metal sheets. For resist, we used commercial acrylic cast sheets. Microstructures 840 μm thick were fabricated by deep x‐ray lithography and used as templates for copper electroforming. A technology for the high contrast masks required to work at these short wavelengths is being developed and a deep etch x‐ray lithography facility is under construction at the ALS.


Proceedings of SPIE | 1995

Fabricating subcollimating grids for an x-ray solar imaging spectrometer using LIGA techniques

Reid A. Brennen; Michael H. Hecht; Dean V. Wiberg; Steven Manion; William D. Bonivert; Jill M. Hruby; Marcus L. Scholz; T. D. Stowe; Thomas W. Kenny; Keith H. Jackson; Chantal G. Khan Malek

We are fabricating sub-collimating X-ray grids that are to be used in an instrument for the High Energy Solar Spectroscopic Imager (HESSI), a proposed NASA mission. The HESSI instrument consists of twelve rotating pairs of high aspect ratio, high Z grids, each pair of which is separated by 1.7 meters and backed by a single Ge detector. The pitch for these grid pairs ranges from 34 micrometers to 317 micrometers with the grid slit openings being 60% of the pitch. For maximum grid X-ray absorbing with minimum loss of the solar image, the grid thickness-to-grid-slit ratio must be approximately 50:1, resulting in grid thicknesses of 1 to 10 millimeters. For our proof-of-concept grids we are implementing a design in which a 34 micrometers pitch, free-standing PMMA grid is fabricated with 20 micrometers wide slits and an 800 micrometers thickness. Stiffeners that run perpendicular to the grid are placed every 500 micrometers . After exposure and developing, metal, ideally gold, is electrodeposited into the free-standing PMMA grid slits. The PMMA is not removed and the metal in the slits acts as the X-ray absorber grid while the PMMA holds the individual metal pieces in place, the PMMA being nearly transparent to the X-rays coming from the sun. For optimum imaging performance, the root-mean-square pitch of the two grids of each pair must match to within 1 part in 10000 and simultaneous exposures of stacked sheets of PMMA have insured that this requirement is met.


Proceedings of SPIE | 1995

Fabrication of miniaturized electrostatic deflectors using LIGA

Keith H. Jackson; Chantal Khan Malek; Lawrence P. Murray; William D. Bonivert; Jill M. Hruby; John T. Hachman; T. H.J. Chang

We are currently investigating the fabrication of high precision, miniaturized, electrostatic deflectors for use in electron or ion beam micro-columns. These columns can be used in a broad array of applications including microscopy, spectroscopy and lithography. Typically, micro-columns consist of a field emitter tip, a set of micromachined miniaturized lenses and one or more electrostatic deflectors. Miniaturization of the column allows the use of simple electrostatic lenses to achieve very high performance in a package that is just a few millimeters in length. Presently, all reported microcolumns have included miniaturized but conventionally-machined octupole deflector plates. If micromachined plates are used instead, lower deflection voltage is required for deflection, and the system becomes more amenable to very high speed operation. In addition, some reduction in scan field distortion is expected. These improvements results directly from the higher degree of miniaturization, tighter dimensional control, better placement accuracy, and smoother facets offered by micromachining. Given the dimensions (100 micrometers - 1000 micrometers thick) and tolerances (1 - 10 micrometers ) required, LIGA is well suited to fabricate such miniature deflectors. This paper will describe the fabrication of the deflectors using LIGA. The Center for X-ray Optics has built an endstation at Lawrence Berkeley National Laboratorys Advanced Light Source suitable for LIGA X-ray exposures.


Proceedings of SPIE | 1995

Fine Pitch Grids for an X-Ray Solar Imaging Spectrometer Fabricated by Optical Lithography and XeF2 Etching

Reid A. Brennen; Michael H. Hecht; Dean V. Wiberg; Steven Manion; William D. Bonivert; Jill M. Hruby; Kristofer S. J. Pister; Ezekiel J. Kruglick

We have developed fine pitch, sub-collimating X-ray grids for an instrument in the High Energy Solar Spectroscopic Imager (HESSI), a proposed NASA mission. In addition to high- energy X-rays, the instrument requires collimation of photons with energies of less than 4 keV such that free-standing grids are required that have no material between the grid slats. We have fabricated 25 micrometer thick gold grids that can collimate photons from visible light up to 30 keV X-rays. They are 55 millimeters in diameter and have 200 micrometer thick silicon support structures. The fabrication process starts with 200 micrometer thick 3 inch wafers onto which a 50 angstrom chrome, 300 angstrom gold electroplating strike is e-beam evaporated. A 25 micrometer thick optical resist is deposited on the wafers using a low spin rate. The resist is exposed and developed and an oxygen plasma clean is performed to fully strip resist residue from the strike. 25 micrometers of gold is then plated in the resist mold, resulting in a gold grid with photoresist between each gold slat. The wafer is turned over and a 50 micrometer dry resist is patterned such that it has a array of 1 by 4 millimeter openings to the silicon. The silicon is etched through to the chrome/gold strike using a xenon difluoride etching process. Both types of photoresist are removed with acetone followed by a piranha clean and the chrome/gold strike is removed with a hydrochloric acid and hydrogen peroxide chrome etch which also slowly etches gold.


Review of Scientific Instruments | 1996

Precision manufacturing using LIGA (abstract)

Keith H. Jackson; Chantal Khan Malek; William D. Bonivert; Jill M. Hruby; John T. Hachman; Reid A. Brennen; Dean V. Wiberg; Michael H. Hecht

Our objective is the fabrication of small high‐precision parts using LIGA, which can be used in a variety of industrial applications. LIGA is a combination of deep x‐ray lithography, electroplating, and replication processes that enables the fabrication of microstructures with vertical dimensions several millimeters high, lateral dimensions in the micrometer range, and submicron tolerances. On beamline 10.3.2, at the Advanced Light Source (ALS), the Center for X‐ray Optics (CXRO) has built an end station suitable for LIGA. The ALS is an excellent source of radiation for this application. The CXRO, in close collaboration with Sandia National Laboratory and the Jet Propulsion Laboratory, has developed the other essential process steps of mask making, resist development, x‐ray exposure, and electroplating. This technology provides a powerful tool for mass production and miniaturization of mechanical systems into a dimensional regime not accessible by traditional manufacturing operations. We will present seve...


Microsystem Technologies-micro-and Nanosystems-information Storage and Processing Systems | 1998

Modeling electrodeposition for LIGA microdevice fabrication

Stewart K. Griffiths; Robert H. Nilson; A. Ting; R.W. Bradshaw; William D. Bonivert; Jill M. Hruby


Archive | 2002

Method of fabricating a 3-dimensional tool master

William D. Bonivert; John T. Hachman

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Jill M. Hruby

Sandia National Laboratories

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John T. Hachman

Sandia National Laboratories

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Michael H. Hecht

California Institute of Technology

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Stewart K. Griffiths

Sandia National Laboratories

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A. Ting

Sandia National Laboratories

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Dean V. Wiberg

Jet Propulsion Laboratory

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Keith H. Jackson

Lawrence Berkeley National Laboratory

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Reid A. Brennen

Jet Propulsion Laboratory

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Alfredo M. Morales

Sandia National Laboratories

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Chantal Khan Malek

Lawrence Berkeley National Laboratory

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