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Featured researches published by Yasutoshi Okuno.


Integrated Ferroelectrics | 2001

Stabilization of ultra-thin Pt bottom electrode for 0.15 μm cup-type BST capacitor

Akihiko Tsuzumtani; Yasutoshi Okuno; Michinari Yamanaka; Yoshihiro Mori

Abstract Structural properties and electrical properties of the ultra-thin Pt film on the cup-type structure were studied. We found that Pt film was segregated inside the cup-type structure after oxygen ambient anneal above 400 °C. For the cup-type structure, the segregation was occurred by Pt migration from bottom part of the cup structure, the thinner area, to top part of the cup structure, the thicker area. To overcome this Pt segregation issue, we developed a post-anneal sequences using hydrogen ambient. With the optimized post-anneal sequence, hydrogen anneal above 500 °C, was be able to prevent from the segregation of Pt thin film for bottom electrodes of the cup structure. It was confirmed that the Pt bottom electrode annealed in hydrogen ambient did not degrade the electrical properties of the BST film. In addition, using this novel anneal sequence, 0.15 μm cup-type BST capacitor was demonstrated the leakage current of 1 fA/cell and capacitance density of 12 fF/cell.


Archive | 2004

Semiconductor memory device and method for fabricating the same

Yasutoshi Okuno


Archive | 2005

Gapfill using deposition-etch sequence

Manoj Vellaikal; Hemant P. Mungekar; Young S. Lee; Yasutoshi Okuno; Hiroshi Yuasa


Archive | 2008

Electronic device and manufacturing method thereof

Yasutoshi Okuno


Archive | 2004

Resistance defect assessment device, resistance defect assessment method, and method for manufacturing resistance defect assessment device

Michikazu Matsumoto; Yasutoshi Okuno; Katsuyoshi Joukyu; Tetsuya Matsutani


Microelectronic Engineering | 2008

Analysis of irregular increase in sheet resistance of Ni silicides on transition from NiSi to NiSi2

Kazuo Tsutsui; Ruifei Xiang; Koji Nagahiro; Takashi Shiozawa; Parhat Ahmet; Yasutoshi Okuno; Michikazu Matsumoto; Masafumi Kubota; Kuniyuki Kakushima; Hiroshi Iwai


Archive | 2005

Semiconductor package, ID generating system thereof, ID recognizing system thereof, ID recognition method thereof, semiconductor integrated circuit chip, ID generating system thereof, ID recognizing system thereof, and ID recognition method thereof

Michikazu Matsumoto; Yasutoshi Okuno; Kazuyoshi Tsukamoto; Toshiki Yabu


Archive | 2010

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME

Tomoe Kutouchi; Yasutoshi Okuno; Sunao Yamaguchi; 知恵 久都内; 泰利 奥野; 直 山口


Archive | 2005

SEMICONDUCTOR PACKAGE, ITS IDENTIFYING APPARATUS, ITS ID RECOGNIZER AND RECOGNIZING METHOD, SEMICONDUCTOR INTEGRATED CIRCUIT CHIP AND ITS IDENTIFYING APPARATUS

Michiichi Matsumoto; Yasutoshi Okuno; Kazuyoshi Tsukamoto; Toshiki Yabu; 和芳 塚本; 泰利 奥野; 道一 松元; 俊樹 薮


Archive | 2004

Device and method for evaluating resistance failure, and manufacturing method of device

Katsuyoshi Kamihisa; Michiichi Matsumoto; Tetsuya Matsutani; Yasutoshi Okuno; 勝義 上久; 泰利 奥野; 道一 松元; 哲也 松谷

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