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Dive into the research topics where Yung-Yuan Chen is active.

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Featured researches published by Yung-Yuan Chen.


IEEE Transactions on Computers | 1997

A comprehensive reconfiguration scheme for fault-tolerant VLSI/WSI array processors

Yung-Yuan Chen; Shambhu J. Upadhyaya; Ching-Hwa Cheng

This paper presents an effective reconfiguration scheme consisting of detailed spare replacement, processor placement, routing, and switch programming mechanisms. A new switch programming scheme is proposed to reduce the hardware overhead of reconfiguration. A thorough yield simulation tool has been developed for accurate prediction of yield by considering the effects of defect clusters and switching network failures. This yield simulation tool can also be used to obtain the information on the performance degradation, spare replacement, processor placement, routing and the switch programming algorithm survival probability.


IEEE Transactions on Computers | 1993

Reliability, reconfiguration, and spare allocation issues in binary-tree architectures based on multiple-level redundancy

Yung-Yuan Chen; Shambhu J. Upadhyaya

The locally redundant modular tree (LRMT) schemes offer high yield and reliability for trees of relatively few levels but are less effective for large binary trees due to the imbalance of reliability of different levels. A new multiple-level redundancy tree (MLRT) architecture that combines modular schemes with level-oriented schemes which lead to better yield and reliability is presented. The MLRT structure enhances the wafer yield to significant levels by offering separate layers of protection for random and clustered defects. Unlike most existing techniques, this technique performs a more accurate reliability analysis by taking into account both switch and link failures. A measure called the marginal switch to processing element area ratio (MSR) is introduced to precisely characterize the effect of switch complexity on the reliability of the redundant system. A systematic method for the optimal distribution of spare modules of the MLRT structure is also presented. The analyses show that the MLRT structure offers higher yield and system reliability than LRMT and subtree-oriented fault-tolerance (SOFT) structures do. >


IEEE Transactions on Computers | 2005

Concurrent detection of control flow errors by hybrid signature monitoring

Yung-Yuan Chen

In this paper, we present a new concurrent error-detection scheme by hybrid signature to the online detection of program memory and control flow errors caused by transient and intermittent faults. The proposed hybrid signature-monitoring technique combines the vertical signature with the horizontal signature schemes. We first develop a new vertical signature based on linear additive code whose signature length could be easily adjusted. The attribute of adjustable length in vertical signature offers the feasibility to integrate the vertical signature, horizontal signature, and length of block into a single signature word. The horizontal signature mechanism can compensate for the coverage degradation due to the reduction of vertical signature length and significantly decrease the error-detection latency as well. The extensive block-based bit-error simulation and hardware-based simulated fault injection experiment are conducted to validate the effectiveness of the proposed technique: compared to the continuous signature monitoring (CSM) scheme, there are several notable enhancements accomplished in our work. One is the fault model used in our work is more realistic than the model employed in CSM. Another is the hardware-based experiments are performed so as to measure the design parameters more accurately. The final one is our scheme does not require being equipped with SEC-DED code in program memory in order to achieve the horizontal signatures if instruction bit correction is not an essential demand; as a result, our scheme is more flexible than CSM.


international symposium on industrial embedded systems | 2009

SoC-level risk assessment using FMEA approach in system design with SystemC

Yung-Yuan Chen; Chung-Hsien Hsu; Kuen-Long Leu

As system-on-chip (SoC) becomes prevalent in the intelligent system applications, the reliability issue of SoC is getting more attention in the design industry due to the rapid increasing rate of radiation-induced soft errors while the SoC fabrication enters the very deep submicron technology. Therefore, the SoC dependability becomes a critical issue in safety-critical applications. Validating such systems is imperative to guarantee the dependability of the systems before they are being put to use. Moreover, it is beneficial to assess the SoC robustness in early design phase in order to significantly reduce the cost and time of re-design. To fill such needs, in this study, we propose a useful IP-based SoC-level risk model using failure mode and effects analysis (FMEA) method to assess the robustness of a SoC in SystemC transaction-level modeling (TLM) design level. The proposed risk model is able to facilitate the measure of the robustness and scales of failure-induced risks in a system, which can be used to identify the critical components and major failure modes for protection so as to effectively reduce the impact of failures to the system. A case study is used to demonstrate our risk model under CoWare Platform Architect environment. A system verification tool was created to assist us in measuring the robustness of the system, in locating the weaknesses of the system, and in understanding the effect of faults on system failure behavior during the SoC design phase. The contribution of this work is to promote the dependability verification to TLM abstraction level that can significantly enhance the simulation performance, and provide the comprehensive results to validate the system dependability in early design phase for safety-critical applications.


Microprocessors and Microsystems | 2010

Reliable data path design of VLIW processor cores with comprehensive error-coverage assessment

Yung-Yuan Chen; Kuen-Long Leu

In this paper, an effective fault-tolerant framework offering very high error coverage with zero detection latency is proposed to protect the data paths of VLIW processor cores. The feature of zero detection latency is essential to real-time error-recovery. The proposed framework provides the error-handling schemes of varying hardware complexity, performance and error coverage to be selected. A case study with an experimental VLIW architecture implemented in VHDL was used to demonstrate the impacts of our technique on hardware overhead and performance degradation. The fault injection experiments were performed to characterize the effects of fault-occurring frequency as well as workload variations on the error coverage, and the permanent faults on the length of time spent for error-recovery. The results observed from the experiments show that our approach can well protect the VLIW data paths even in a very severe fault scenario. As a result, the proposed fault-tolerant VLIW core is quite suitable for the highly dependable embedded applications.


defect and fault tolerance in vlsi and nanotechnology systems | 2003

An integrated fault-tolerant design framework for VLIW processors

Yung-Yuan Chen; Shi-Jinn Horng; Hung-Chuan Lai

In this study, a fault-tolerant design framework of VLIW processor is proposed. Specifically, this paper concentrates on the issue of dependable data path design. We first use three identical functional modules in the data paths to demonstrate our fault-tolerant technique. Basically, we add one spare module in this illustration and refine on the concepts of triple modular redundancy and comparison to achieve fault detection, fault location and error recovery. A real-time error recovery process is developed to overcome the faults. Hardware architecture and its implementation in VHDL are presented. An analysis of hardware overhead and performance degradation is conducted to validate our scheme. We show that the proposed scheme can be easily extended to data paths which contains more than three identical functional modules. In addition, for a specific number of identical modules, the fault-tolerant framework provides a design choice among several feasible solutions in terms of hardware overhead, performance degradation and dependability requirements. Finally, hardware overhead and performance degradation of the proposed technique decreases while the number of identical modules increases in the data path of VLIW processors.


[1990] Digest of Papers. Fault-Tolerant Computing: 20th International Symposium | 1990

An analysis of a reconfigurable binary tree architecture based on multiple-level redundancy

Yung-Yuan Chen; Shambhu J. Upadhyaya

The analysis of a multiple-level redundant tree (MLRT) structure is presented for the design of a reconfigurable tree architecture. The MLRT scheme tolerates the catastrophic failure of several locally redundant modules in the corresponding locally redundant modular tree (LRMT) structure. This analysis and experimental study establishes the advantages of the MLRT structure over the LRMT structure. The switch failures are taken into account for an accurate analysis of the reliability. A new measure, called the marginal-switch-to-processing-element-area ratio (MSR), is introduced to characterize the effect of switch complexity on the reliability of the redundant system. It can be used as an evaluation criterion in the design of practical fault-tolerant multiprocessor architectures. A technique for obtaining the best spare distribution in the MLRT structure is presented.<<ETX>>


secure software integration and reliability improvement | 2008

System-Bus Fault Injection Framework in SystemC Design Platform

Kun-Chun Chang; Yi-Chinag Wang; Chung-Hsien Hsu; Kuen-Long Leu; Yung-Yuan Chen

As system-on-chip (SoC) becomes prevalent in the intelligent system applications, the reliability issue of SoC is getting more attention in the design industry while the SoC fabrication enters the very deep submicron technology. In this study, we present a new approach of system-bus fault injection in SystemC design platform, which can be used to assist us in performing the FMEA procedure during the SoC design phase. We demonstrate the feasibility of the proposed fault injection mechanism with an experimental ARM-based system.


IEEE Transactions on Computers | 1994

Modeling the reliability of a class of fault-tolerant VLSI/WSI systems based on multiple-level redundancy

Yung-Yuan Chen; Shambhu J. Upadhyaya

A class of fault-tolerant Very Large Scale Integration (VLSI) and Wafer Scale Integration (WSI) schemes, called the multiple-level redundancy, which incorporates both hierarchical and element level redundancy has been proposed for the design of high yield and high reliability large area array processors. The residual redundancy left unused after successfully reconfiguring and eliminating the manufacturing defects can be used to improve the operational reliability of a system. Since existing techniques for the analysis of the effect of residual redundancy on reliability improvement are not applicable, we present a new hierarchical model to estimate the reliability of the systems designed by our approach. Our model emphasizes the effect of support circuit (interconnection) failures on system reliability, leading to more accurate analysis. We discuss two area prediction models, one based on the regular WSI process, another based on the advanced WSI process, to estimate the area-related parameters. This analysis gives an insight into the practical implementations of fault-tolerant schemes in VLSI/WSI technology. Results of a computer experiment conducted to validate our models are also discussed. >


IEEE Transactions on Computers | 1993

Yield analysis of reconfigurable array processors based on multiple-level redundancy

Yung-Yuan Chen; Shambhu J. Upadhyaya

Presents and analyzes a new multiple-level redundancy scheme based on hierarchical and element level redundancy for the enhancement of yield and reliability of large area array processors. This scheme can effectively tolerate not only the random defects/faults, but also the clustered defects/faults. The analysis presented here is general in that it takes into account the chip-kill defects occurring in the support circuit area of the array processors and is applicable to a variety of array processors. The authors derive bounds for the support circuit area which will be useful in selecting the most cost-effective redundancy scheme for a given application. The concept of subprocessing element-level redundancy is discussed and it is shown that a combination of subprocessing element-level redundancy with hierarchical redundancy offers significant yield improvements, especially for array processors with large area processing elements. The problem of optimal redundancy is also addressed. >

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Kuen-Long Leu

National Central University

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Jwu-E Chen

National Central University

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Chin-Long Wey

National Chiao Tung University

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Chung-Hsien Hsu

National Central University

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Gene Eu Jan

National Taipei University

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Hsiang Huang

National Taipei University

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Hung-Chuan Lai

National Taiwan University of Science and Technology

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