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Dive into the research topics where Yvon Imbs is active.

Publication


Featured researches published by Yvon Imbs.


2016 6th Electronic System-Integration Technology Conference (ESTC) | 2016

Optimization and validation of a package and motherboard decoupling strategy

David Auchere; Xavier Lecoq; Yvon Imbs

This paper has shown interesting decoupling solutions of PDNs, when they should be employed and what tradeoff between electrical performance and cost should be considered. It has shown through a concrete example the PDN decoupling strategy done on a typical set top box product and its validation through measurement and simulation. Finally it has briefly discussed the correlation capability of modelling versus measurement.


topical meeting on silicon monolithic integrated circuits in rf systems | 2012

High performance RF inductors integrated in advanced Fan-Out wafer level packaging technology

Cédric Durand; F. Gianesello; Romain Pilard; Daniel Gloria; Yvon Imbs; Romain Coffy; Laurent Marechal; Yonggang Jin; Yves Dodo


Archive | 2011

SEMICONDUCTOR DEVICE COMPRISING A PASSIVE COMPONENT OF CAPACITORS AND PROCESS FOR FABRICATION

Laurent Marechal; Yvon Imbs; Romain Coffy


Archive | 2010

ELECTRONIC CIRCUIT WITH AN INDUCTOR

Romain Coffy; Yvon Imbs; Laurent Marechal


european microelectronics and packaging conference | 2013

60GHz BGA solution packaging reliability and warpage study

Didier Campos; Romain Pilard; Eric Saugier; Yvon Imbs; Jean-Michel Riviere; Jerome Lopez; Pierino Calascibetta; Norbert Chevrier; Luc Petit; Nadine Martin; Martine Salle; F. Gianesello; Aymeric Bisognin; Daniel Gloria; Phone-Maw Hla; Kim Yong Goh


Archive | 2014

INTEGRATED CIRCUIT CHIP COMPRISING ELECTRONIC DEVICE AND ELECTRONIC SYSTEM

David Auchere; Yvon Imbs


european microelectronics and packaging conference | 2013

BGA package technology considerations for high speed and RF applications

Laurent Marechal; David Auchere; Yvon Imbs


Archive | 2017

ELECTRONIC DEVICE PROVIDED WITH AN INTEGRAL CONDUCTIVE WIRE AND METHOD OF MANUFACTURE

Yvon Imbs; Laurent Schwarz; David Auchere; Laurent Marechal


Archive | 2017

ELECTRONIC DEVICE PROVIDED WITH AN INTEGRATED CONDUCTOR ELEMENT AND FABRICATION METHOD

David Auchere; Laurent Marechal; Yvon Imbs; Laurent Schwarz


european microelectronics and packaging conference | 2013

BGA packages classification to reach ESD CDM standards

David Auchere; Gerald Afflard; Blaise Jacquier; Stephan Jeune; Corinne Richier; A. Dray; Celine Roussel; David Aleo; Eric Picolet; Cedric Le Borgne; Yvon Imbs; Laurent Marechal

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