Zakaria Moktadir

Microfabricated high-finesse optical cavity with open access and small volume

We present a microfabricated optical cavity, which combines a very small mode volume with high finesse. In contrast to other micro-resonators, such as microspheres, the structure we have built gives atoms and molecules direct access to the high-intensity part of the field mode, enabling them to interact strongly with photons in the cavity for the purposes of detection and quantum-coherent manipulation. Light couples directly in and out of the resonator through an optical fiber, avoiding the need for sensitive coupling optics. This renders the cavity particularly attractive as a component of a lab-on-a-chip, and as a node in a quantum network.

Pyramidal micromirrors for microsystems and atom chips

Concave pyramids are created in the (100) surface of a silicon wafer by anisotropic etching in potassium hydroxide. High quality micromirrors are then formed by sputtering gold onto the smooth silicon (111) faces of the pyramids. These mirrors show great promise as high quality optical devices suitable for integration into micro-optoelectromechanical systems and atom chips. We have shown that structures of this shape can be used to laser-cool and hold atoms in a magneto-optical trap.

Integrated optical components on atom chips

Abstract.We report on the integration of small-scale optical components into silicon wafers for use in atom chips. We present an on-chip fibre-optic atom detection scheme that can probe clouds with small atom numbers. The fibres can also be used to generate microscopic dipole traps. We describe our most recent results with optical microcavities and show that a sufficiently high finesse can be achieved to enable single-atom detection on an atom chip. The key components have been fabricated by etching directly into the atom chip silicon substrate.

Fabrication of MEMS components using ultrafine-grained aluminium alloys

A novel process for the fabrication of a microelectromechanical systems (MEMS) metallic component with features smaller than 10 µm and high thermal conductivity was investigated. This may be applied to new or improved microscale components, such as (micro-) heat exchangers. In the first stage of processing, equal channel angular pressing (ECAP) was employed to refine the grain size of commercial purity aluminium (Al-1050) to the ultrafine-grained (UFG) material. Embossing was conducted using a micro silicon mould fabricated by deep reactive ion etching (DRIE). Both cold embossing and hot embossing were performed on the coarse-grained and UFG Al-1050. Cold embossing on UFG Al-1050 led to a partially transferred pattern from the micro silicon mould and high failure rate of the mould. Hot embossing on UFG Al-1050 provided a smooth embossed surface with a fully transferred pattern and a low failure rate of the mould, while hot embossing on the coarse-grained Al-1050 resulted in a rougher surface with shear bands

Fabrication of Magnetooptical Atom Traps on a Chip

Ultracold atoms can be manipulated using microfabricated devices known as atom chips. These have significant potential for applications in sensing, metrology, and quantum information processing. To date, the chips are loaded by transfer of atoms from an external macroscopic magnetooptical trap (MOT) into microscopic traps on the chip. This transfer involves a series of steps, which complicate the experimental procedure and lead to atom losses. In this paper, we present a design for integrating a MOT into a silicon wafer by combining a concave pyramidal mirror with a square wire loop. We describe how an array of such traps has been fabricated, and we present magnetic, thermal, and optical properties of the chip.

Etching techniques for realizing optical micro-cavity atom traps on silicon

We have fabricated curved optical micromirrors on silicon. We expect to be able to form open optical cavities between these mirrors and plane mirrors coated on the ends of optical fibres. The curved mirror templates have been prepared with less than 10 nm surface roughness by means of isotropic chemical etching. Two different methods are used for the fabrication of the mirrors: the first method uses a silicon oxide mask, while the second uses dry etching to form an indentation in the silicon surface that is opened out by wet isotropic etching. After coating the silicon substrate with gold, good quality mirrors are obtained with R ∼ 98% in the near infra-red. We find that a reflectivity of approximately 98% can be achieved by this method. Cavities formed from these mirrors will be useful for manipulating single atoms.

Tailoring the thermal Casimir force with graphene

The Casimir interaction is omnipresent source of forces at small separations between bodies, which is difficult to change by varying external conditions. Here we show that graphene interacting with a metal can have the best known force contrast to the temperature and the Fermi level variations. In the distance range 50–300 nm the force is measurable and can vary a few times for graphene with a bandgap much larger than the temperature. In this distance range the main part of the force is due to the thermal fluctuations. We discuss also graphene on a dielectric membrane as a technologically robust configuration.

Multifractal properties of Pyrex and silicon surfaces blasted with sharp particles

The blasting of brittle materials with sharp particles is an important fabrication technology in many industrial processes. In particular, for microsystems, it allows the production of devices with feature sizes down to few tens of microns. An important parameter of this process is the surface roughness of post-blasted surfaces. In this work the scaling properties of Pyrex glass and silicon surfaces after bombardment with alumina particles are investigated. The targets were bombarded at normal incidence using alumina particles with two different average sizes, 29 μm and 9 μm. This investigation indicates that the resulting surfaces are multifractal. Applying multifractal detrended fluctuation analysis (MFDFA) allowed us to determine the singularity spectrum of the surfaces. This spectrum did not depend on the target material or on the size of the particles. Several parameters quantifying relevant quantities were determined. It was found that long range correlations are responsible for the observed multifractal behaviour.

Atom chip for BEC interferometry

We have fabricated and tested an atom chip that operates as a matter wave interferometer. In this communication we describe the fabrication of the chip by ion-beam milling of gold evaporated onto a silicon substrate. We present data on the quality of the wires, on the current density that can be reached in the wires and on the smoothness of the magnetic traps that are formed. We demonstrate the operation of the interferometer, showing that we can coherently split and recombine a Bose–Einstein condensate with good phase stability.

A three-dimensional electrostatic actuator with a locking mechanism for microcavities on atom chips

A micromachined three-dimensional electrostatic actuator that is optimized for aligning and tuning optical microcavities on atom chips is presented. The design of the 3D actuator is outlined in detail, and its characteristics are verified by analytical calculations and finite element modelling. Furthermore, the fabrication process of the actuation device is described and preliminary fabrication results are shown. The actuation in the chip plane which is used for mirror positioning has a working envelope of 17.5 ?m. The design incorporates a unique locking mechanism which allows the out-of-plane actuation that is used for cavity tuning to be carried out once the in-plane actuation is completed. A maximum translation of 7 ?m can be achieved in the out-of-plane direction.