Is this you? Create Your Porfile
Avatar

Abelardo Hadap Advincula

STATS ChipPAC Ltd

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Abelardo Hadap Advincula is active.

Explore More

Publication

Featured researches published by Abelardo Hadap Advincula.

Archive | 2008

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PLANAR INTERCONNECT

Zigmund Ramirez Camacho; Lionel Chien Hui Tay; Henry Descalzo Bathan; Abelardo Hadap Advincula

Archive | 2007

INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH LEADS

Zigmund Ramirez Camacho; Arnel Senosa Trasporto; Jeffrey D. Punzalan; Abelardo Hadap Advincula

Archive | 2007

Integrated circuit package system with array of external interconnects

Zigmund Ramirez Camacho; Henry Descalzo Bathan; Abelardo Hadap Advincula; Lionel Chien Hui Tay

Archive | 2007

Integrated circuit package system with thin profile

Zigmund Ramirez Camacho; Henry Descalzo Bathan; Abelardo Hadap Advincula; Lionel Chien Hui Tay

Archive | 2007

Integrated circuit package system with different connection structures

Lionel Chien Hui Tay; Zigmund Ramirez Camacho; Abelardo Hadap Advincula

Archive | 2007

Integrated circuit package system with package encapsulation having recess

Zigmund Ramirez Camacho; Jeffrey D. Punzalan; Jairus Legaspi Pisigan; Abelardo Hadap Advincula

Archive | 2009

Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof

Zigmund Ramirez Camacho; Abelardo Hadap Advincula; Erwin Aguas Sangalang; Lionel Chien Hui Tay

Archive | 2008

Mountable integrated circuit package system with exposed external interconnects

Zigmund Ramirez Camacho; Abelardo Hadap Advincula; Henry Descalzo Bathan; Lionel Chien Hui Tay

Archive | 2007

Integrated circuit package system with package integration

Zigmund Ramirez Camacho; Jairus Legaspi Pisigan; Abelardo Hadap Advincula; Lionel Chien Hui Tay

Archive | 2008

Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof

Arnel Senosa Trasporto; Lionel Chien Hui Tay; Zigmund Ramirez Camacho; Abelardo Hadap Advincula

Explore More

Collaboration

Dive into the Abelardo Hadap Advincula's collaboration.

Top Co-Authors
Avatar

Zigmund Ramirez Camacho

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Lionel Chien Hui Tay

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Henry Descalzo Bathan

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Arnel Senosa Trasporto

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Jeffrey D. Punzalan

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Jairus Legaspi Pisigan

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Erwin Aguas Sangalang

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Jose Alvin Caparas

STATS ChipPAC Ltd

View shared research outputs
Explore More
Researchain Logo
Decentralizing Knowledge