Is this you? Create Your Porfile
Avatar

Lionel Chien Hui Tay

STATS ChipPAC Ltd

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Lionel Chien Hui Tay is active.

Explore More

Publication

Featured researches published by Lionel Chien Hui Tay.

Archive | 2012

Semiconductor Device and Method of Forming Wafer Level Ground Plane and Power Ring

Guruprasad G. Badakere; Zigmund Ramirez Camacho; Lionel Chien Hui Tay

Archive | 2007

Semiconductor Device with Optical Sensor and Method of Forming Interconnect Structure on Front and Backside of the Device

Zigmund Ramirez Camacho; Henry Descalzo Bathan; Lionel Chien Hui Tay; Arnel Senosa Trasporto

Archive | 2008

Through Hole Vias at Saw Streets Including Protrusions or Recesses for Interconnection

Reza A. Pagaila; Zigmund Ramirez Camacho; Lionel Chien Hui Tay; Byung Tai Do

Archive | 2010

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

Henry Descalzo Bathan; Zigmund Ramirez Camacho; Lionel Chien Hui Tay; Arnel Senosa Trasporto

Archive | 2009

Leadframe design for QFN package with top terminal leads

Zigmund Ramirez Camacho; Henry Descalzo Bathan; Jose Alvin Caparas; Lionel Chien Hui Tay

Archive | 2013

Semiconductor Device and Method of Forming a Wafer Level Package with Top and Bottom Solder Bump Interconnection

Zigmund Ramirez Camacho; Lionel Chien Hui Tay; Henry Descalzo Bathan; Dioscoro A. Merilo; Jeffrey D. Punzalan

Archive | 2010

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLATED LEADS AND METHOD OF MANUFACTURE THEREOF

Zigmund Ramirez Camacho; Henry Descalzo Bathan; Lionel Chien Hui Tay

Archive | 2008

Semiconductor Device and Method of Forming a Wafer Level Package with Bump Interconnection

Zigmund Ramirez Camacho; Lionel Chien Hui Tay; Henry Descalzo Bathan; Jeffrey D. Punzalan

Archive | 2008

Semiconductor Device and Method of Forming a Conductive Via-in-Via Structure

Lionel Chien Hui Tay; Jianmin Fang; Zigmund Ramirez Camacho

Archive | 2007

Semiconductor Package and Method of Forming Similar Structure for Top and Bottom Bonding Pads

Lionel Chien Hui Tay; Henry Descalzo Bathan; Zigmund Ramirez Camacho

Explore More

Collaboration

Dive into the Lionel Chien Hui Tay's collaboration.

Top Co-Authors
Avatar

Zigmund Ramirez Camacho

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Henry Descalzo Bathan

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Jairus Legaspi Pisigan

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Jeffrey D. Punzalan

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Arnel Senosa Trasporto

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Abelardo Hadap Advincula

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Dioscoro A. Merilo

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Jose Alvin Caparas

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Frederick Rodriguez Dahilig

STATS ChipPAC Ltd

View shared research outputs
Top Co-Authors
Avatar

Seng Guan Chow

STATS ChipPAC Ltd

View shared research outputs
Explore More
Researchain Logo
Decentralizing Knowledge