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Hotspot


Dive into the research topics where Jairus Legaspi Pisigan is active.

Publication


Featured researches published by Jairus Legaspi Pisigan.


Archive | 2007

Integrated circuit package system with leads separated from a die paddle

Jeffrey D. Punzalan; Jairus Legaspi Pisigan; Lionel Chien Hui Tay; Zigmund Ramirez Camacho


Archive | 2008

Method and Apparatus For a Package Having Multiple Stacked Die

Zigmund Ramirez Camacho; Jairus Legaspi Pisigan; Lionel Chien Hui Tay; Henry Descalzo Bathan


Archive | 2009

Semiconductor Device and Method of Forming Vertical Interconnect Structure Between Non-Linear Portions of Conductive Layers

Zigmund Ramirez Camacho; Dioscoro A. Merilo; Jairus Legaspi Pisigan; Frederick Rodriguez Dahilig


Archive | 2007

Integrated circuit package system with dual connectivity

Zigmund Ramirez Camacho; Jairus Legaspi Pisigan; Jose Alvin Caparas; Lionel Chien Hui Tay


Archive | 2012

Semiconductor Device and Method of Forming Overlapping Semiconductor Die with Coplanar Vertical Interconnect Structure

Henry Descalzo Bathan; Zigmund Ramirez Camacho; Jairus Legaspi Pisigan


Archive | 2007

Integrated circuit package system with leadframe array

Jairus Legaspi Pisigan; Jeffrey D. Punzalan; Lionel Chien Hui Tay; Zigmund Ramirez Camacho


Archive | 2007

Integrated circuit packaging system with base structure device

Jong-Woo Ha; Koo Hong Lee; Soo Won Lee; Juhyun Park; Zigmund Ramirez Camacho; Jeffrey D. Punzalan; Lionel Chien Hui Tay; Jairus Legaspi Pisigan


Archive | 2008

MULTI-LAYER PACKAGE-ON-PACKAGE SYSTEM

Lionel Chien Hui Tay; Jairus Legaspi Pisigan; Zigmund Ramirez Camacho


Archive | 2009

Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof

Zigmund Ramirez Camacho; Jairus Legaspi Pisigan; Henry Descalzo Bathan


Archive | 2009

Integrated circuit packaging system with a dual substrate package and method of manufacture thereof

Zigmund Ramirez Camacho; Henry Descalzo Bathan; Jairus Legaspi Pisigan

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