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Andreas Klipp

Infineon Technologies

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Publication

Featured researches published by Andreas Klipp.

Archive | 2004

Gap-filling for isolation

Andreas Klipp; Momtchil Stavrev; Moritz Haupt

Archive | 2006

Method of fabricating a groove-like structure in a semiconductor device

Frank Ludwig; Kimberly Wilson; Arabinda Das; Hans-Peter Sperlich; Andreas Klipp; Kristin Schupke

Archive | 2005

Fabrication method for a semiconductor structure

Moritz Haupt; Andreas Klipp; Hans-Peter Sperlich; Momtchill Stavrev; Stephan Wege

Meeting Abstracts | 2006

Investigating the Role of Stress in SOG-filled Shallow-Trench-Isolation Structures of sub-70 nm Device

Arabinda Das; Andreas Klipp; Hans-Peter Sperlich; Robert Nitsche

Archive | 2004

Method for fabricating a trench isolation structure

Kerstin Mothes; Andreas Klipp; Florian Schmitt; Mark Hollatz

Archive | 2005

Production process for a semiconductor structure in shallow trench isolation forms oxide layer between trench and spin on glass filling and thermally cures

Albert Birner; Andreas Weber; Andreas Klipp; Uwe Wellhausen; Hans-Peter Sperlich

Archive | 2005

Plane spin-on-layer production for use on semiconductor wafer, involves superimposing liner layer on semiconductor structure before superimposition of spin-on-layer, where structure supports planar superimposition of layer on it

Albert Birner; Arabinda Das; Henry Heidemeyer; Mark Hollatz; Andreas Klipp; Hans-Peter Sperlich; Uwe Wellhausen

Archive | 2005

Verfahren zum Herstellen einer ebenen Spin-on-Schicht auf einer Halbleiterstruktur A method of manufacturing a planar spin-on layer on a semiconductor structure

Albert Birner; Arabinda Das; Henry Heidemeyer; Mark Hollatz; Andreas Klipp; Hans-Peter Sperlich; Uwe Wellhausen

Archive | 2005

Filling contact holes in dielectric layer on substrate, comprises removing impurities from hole walls, gassing out residues, applying adhesive layer, and filling with metal compound

Axel Buerke; Jens Hahn; Sven Schmidbauer; Detlef Weber; Andreas Klipp; Norbert Urbansky

Archive | 2005

A method of manufacturing a planar spin-on layer on a semiconductor structure

Albert Birner; Arabinda Das; Henry Heidemeyer; Mark Hollatz; Andreas Klipp; Hans-Peter Sperlich; Uwe Wellhausen

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Collaboration

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Hans-Peter Sperlich

Infineon Technologies

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Mark Hollatz

Infineon Technologies

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Arabinda Das

Qimonda

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Albert Birner

Infineon Technologies

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Uwe Wellhausen

Infineon Technologies

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Florian Schmitt

Infineon Technologies

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Henry Heidemeyer

Infineon Technologies

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Kerstin Mothes

Infineon Technologies

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Moritz Haupt

Infineon Technologies

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Andreas Weber

Infineon Technologies

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