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Featured researches published by Atsuko Takafuji.


Microelectronic Engineering | 2002

An energy analyzer for high-speed secondary electrons accelerated in inspection SEM imaging

Atsuko Takafuji; Hisaya Murakoshi; Hiroyuki Shinada; Miyako Matsui; Hidetoshi Nishiyama; Mari Nozoe

An energy analyzer has been developed to evaluate sample charging and voltage-contrast (VC) in a retarding-type scanning electron microscope (SEM) for inspecting semiconductor devices for defects. Since secondary electrons (SEs) are accelerated by the strong retarding field, a high degree of accuracy is needed to evaluate the energy of SEs. The energy analyzer consists of several electrodes for forming suitable electrostatic lens fields. Evaluation results showed that energy resolution of 2 eV for SE incident energy of 9.5 keV was attained and that evaluations of charging voltages on patterned samples were performed quantitatively.


Journal of Micro-nanolithography Mems and Moems | 2003

Advanced inspection technique for deep-submicron and high-aspect-ratio contact holes

Miyako Matsui; Mari Nozoe; Keiko Arauchi; Atsuko Takafuji; Hidetoshi Nishiyama; Yasushi Goto

We developed a technique using electron beams for inspecting contact holes immediately after dry etching and detecting incomplete contact failures. Wafers with deep-submicron contact holes that had high aspect ratios of 10 could be detected during practical inspection time by controlling the charging effect on the wafer surfaces. Measurements of the energy distribution in the secondary electrons exhausted from the bottom of the holes indicated that they were accelerated by the charge-up voltage on the wafer surfaces. Our analysis showed that high-density electron beams must be used to charge the surfaces when the aspect ratio is high. The minimum thickness of the residual SiO 2 that could be detected at the bottom of the contact holes was 2 nm using an aspect ratio of 8. Applying this mechanism to optimize the dry etching process in semiconductor manufacturing showed that we could achieve reliable process control.


IEEE Transactions on Nuclear Science | 1997

Numerical analysis of electron orbits in a compact high-current circular microtron

Atsuko Takafuji; Katsuya Sugiyama; Katsuhiro Kuroda; Keiji Koyanagi; Masatoshi Nishimura

The performance of a compact high-current circular microtron is investigated by means of computer simulation. The microtron investigated here is operated with the Russian second type of acceleration and has an electron gun, composed of a cathode and an anode, located outside the accelerating cavity. The simulation results enable us to see the possibility of stable acceleration, to estimate the capture coefficient, and to predict the initial conditions necessary for stable acceleration.


IEEE Transactions on Nuclear Science | 1997

A compact high-current circular microtron

Katsuya Sugiyama; Atsuko Takafuji; Katsuhiro Kuroda; Keiji Koyanagi; Ichiro Miura; Eiki Takahashi; Masatoshi Nishimura

A compact high-current circular microtron has been developed. This microtron is operated with the Russian second type of acceleration to reduce its size and has an electron gun outside the accelerating cavity to increase the beam current. The uniform magnetic field is about 0.19 T, and the energy gain per orbit is about 0.9 MeV. The beam current at a microwave power of 2.2 MW is 200 mA at 4 MeV and 80 mA at 9.5 MeV.


SPIE's 1995 International Symposium on Optical Science, Engineering, and Instrumentation | 1995

Optimized secondary electron collection in in-lens-type objective lens

Katsuhiro Kuroda; Atsuko Takafuji; Kenichi Yamamoto; Mitsugu Satou

Secondary Electron (SE) trajectories were numerically simulated for an ultra-high resolution Hitachi S-900 SEM with an in-lens type objective lens in order to optimize the SE detector position. The trajectories of SEs emitted from the sample were computed as follows. The electrostatic field of SE detector was calculated by a 2D rectangular finite element method (FEM). On the other hand, the magnetic field of the objective lens was calculated by a 2D axially symmetrical FEM. SE trajectories were then 3D simulated by Runge-Kutta method. The SE detector angle relative to the electron optical axis was changed from 45 degree(s) to 60 degree(s) and the SE trajectories were calculated for a various SE positions on the sample at 1 kV to 30 kV accelerating voltage. As a result, the position of the SE detector was optimized so that it gave no variation of brightness even in a low magnification of 250.


Archive | 2001

Method and apparatus for inspecting integrated circuit pattern

Hiroyuki Shinada; Mari Nozoe; Haruo Yoda; Kimiaki Ando; Katsuhiro Kuroda; Yutaka Kaneko; Maki Tanaka; Shunji Maeda; Hitoshi Kubota; Aritoshi Sugimoto; Katsuya Sugiyama; Atsuko Takafuji; Yusuke Yajima; Hiroshi Tooyama; Tadao Ino; Takashi Hiroi; Kazushi Yoshimura; Yasutsugu Usami


Archive | 1988

Pattern inspection device

Hisaya Murakoshi; Yusuke Yajima; Hiroyuki Shinada; Mari Nozoe; Atsuko Takafuji; Kaoru Umemura; Masaki Hasegawa; Katsuhiro Kuroda


Archive | 2003

Method of inspecting a circuit pattern and inspecting instrument

Hiroyuki Shinada; Atsuko Takafuji; Takanori Ninomiya; Yuko Sasaki; Mari Nozoe; Hisaya Murakoshi; Taku Ninomiya; Yuji Kasai; Hiroshi Makino; Yutaka Kaneko; Kenji Tanimoto


Archive | 2002

Wafer inspection system and wafer inspection process using charged particle beam

Miyako Matsui; Mari Nozoe; Atsuko Takafuji


Archive | 2004

Patterned wafer inspection method and apparatus therefor

Hiroyuki Shinada; Yusuke Yajima; Hisaya Murakoshi; Masaki Hasegawa; Mari Nozoe; Atsuko Takafuji; Katsuya Sugiyama; Katsuhiro Kuroda; Kaoru Umemura; Yasutsugu Usami

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