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Welding International | 2007

Development of maintenance technology with underwater TIG welding for spent fuel storage pool

Takeshi Obana; Yasumitsu Hamada; Toshihiro Ootsuka; Seiichi Toyoda; Atsushi Hosogane; Kaoru Ooeda; Masahide Katou

The core technology of an underwater TIG welding process has been developed and a welding equipment system has been manufactured for application to the maintenance of the spent fuel storage pool of Rokkasho reprocessing plant. Basic experiments for understanding the conditions of the dry area and the range of welding conditions was performed, and mock examination for simulation of the real environment by using the developed welding equipment was also carried out to judge the applicability of the system. For the purpose of selecting a water removing method for different spatial conditions of the parts to be maintained underwater, two kinds of welding equipment systems of Chamber type and Partition type were developed and manufactured. On the basis of fundamental experiments, the conditions of dry area formation and welding parameter range for high-reliability weld are discussed. Thus the proper condition of this process was able to be established. With the welding equipment systems of the Chamber type and Partition type, the practical use examination of underwater TIG welding process was executed by mock examination for simulating the real environment. As a result, it was confirmed that the underwater TIG welding could obtain the same reliability as a usual in-air TIG welding, and the operation and the control at remote distance were also possible. And the reliability of the patch-plate fillet weld could be evaluated by remote inspection with the expansion visual test.


Archive | 2007

Method of manufacturing semiconductor apparatus

Ryuji Kono; Makoto Kitano; Hideo Miura; Hiroyuki Ota; Yoshishige Endo; Takeshi Harada; Masatoshi Kanamaru; Teruhisa Akashi; Atsushi Hosogane; Akihiko Ariga; Naoto Ban


Archive | 1991

Slider unit controllably actuated at a surface of a moving information recording medium

Takeshi Harada; Masatoshi Kanamaru; Atsushi Hosogane; Akiomi Kohno; Kenji Mori


Archive | 2003

Semiconductor inspection apparatus

Ryuji Kohno; Hideo Miura; Yoshishige Endo; Masatoshi Kanamaru; Atsushi Hosogane; Hideyuki Aoki; Naoto Ban


Archive | 1999

Process for manufacturing semiconductor device

Ryuji Kono; Makoto Kitano; Hideo Miura; Hiroyuki Ota; Yoshishige Endo; Takeshi Harada; Masatoshi Kanamaru; Teruhisa Akashi; Atsushi Hosogane; Akihiko Ariga; Naoto Ban


Archive | 2002

Manufacture method for semiconductor inspection apparatus

Ryuji Kohno; Hideo Miura; Yoshishige Endo; Masatoshi Kanamaru; Atsushi Hosogane; Hideyuki Aoki; Naoto Ban


Archive | 2002

Method for manufacturing semiconductor device utilizing semiconductor testing equipment

Masatoshi Kanamaru; Yoshishige Endo; Atsushi Hosogane; Tatsuya Nagata; Ryuji Kohno; Hideyuki Aoki; Akihiko Ariga


Archive | 2000

Semiconductor testing equipment with probe formed on a cantilever of a substrate

Masatoshi Kanamaru; Yoshishige Endo; Atsushi Hosogane; Tatsuya Nagata; Ryuji Kohno; Hideyuki Aoki; Akihiko Ariga


Archive | 1998

Method for manufacturing substrate for inspecting semiconductor device

Masatoshi Kanamaru; Atsushi Hosogane; Yoshishige Endou; Ryuji Kouno; Hideo Miura; Shinji Tanaka; Hiroyuki Ohta; Akihiko Ariga; Naoto Ban; Hideyuki Aoki


Archive | 1999

Element inspecting probe, manufacture thereof, and semiconductor inspecting device using it

Kiju Endo; Atsushi Hosogane; Masatoshi Kanamaru; Ryuji Kono; Shinji Tanaka; 竜治 河野; 伸司 田中; 敦 細金; 喜重 遠藤; 昌敏 金丸

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