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electronic components and technology conference | 1991

Development of damage detection system for surface mount packages during reflow soldering

Makoto Kitano; Asao Nishimura; Ryuji Kohno

A damage detection system for surface mount packages during reflow soldering has been developed to efficiently evaluate reliability of packages quantitatively. This system is based on measuring the deformation of the packages in the direction of the thickness. A personal computer automatically determines the damage mode and the temperature at which the damage occurred by the displacement profile and the temperature profile. The three possible damage modes-package cracking, delamination of the plastic, and leakage of vapor, which leaves gaps between the plastic and the leads-can be identified by this system.<<ETX>>


Archive | 1994

Encapsulated semiconductor device package having holes for electrically conductive material

Makoto Kitano; Asao Nishimura; Akihiro Yaguchi; Nae Yoneda; Ryuji Kohno; Naotaka Tanaka; Tetsuo Kumazawa


Archive | 1991

Plastic-molded-type semiconductor device

Ryuji Kohno; Asao Nishimura; Makoto Kitano; Akihiro Yaguchi; Nae Yoneda


Archive | 1995

Electronic component, electronic component assembly and electronic component unit

Tetsuo Kumazawa; Makoto Kitano; Akihiro Yaguchi; Ryuji Kohno; Naotaka Tanaka; Nae Yoneda; Ichiro Anjoh


Archive | 2001

Fabrication method of semiconductor integrated circuit device and its testing apparatus

Naoto Ban; Masaaki Namba; Akio Hasebe; Yuji Wada; Ryuji Kohno; Akira Seito; Yasuhiro Motoyama


Archive | 1991

Semiconductor device having a particular chip pad structure

Ryuji Kohno; Makoto Kitano; Asao Nishimura; Akihiro Yaguchi; Sueo Kawai


Archive | 2003

Semiconductor inspection apparatus

Ryuji Kohno; Hideo Miura; Yoshishige Endo; Masatoshi Kanamaru; Atsushi Hosogane; Hideyuki Aoki; Naoto Ban


Archive | 1993

Plastic encapsulated semiconductor device and lead frame

Akihiro Yaguchi; Asao Nishimura; Makoto Kitano; Ryuji Kohno; Nae Yoneda; Ichiro Anjoh; Gen Murakami


Archive | 2003

Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step

Ryuji Kohno; Tetsuo Kumazawa; Makoto Kitano; Akihiko Ariga; Yuji Wada; Naoto Ban; Shuji Shibuya; Yasuhiro Motoyama; Kunio Matsumoto; Susumu Kasukabe; Terutaka Mori; Hidetaka Shigi; Takayoshi Watanabe


Archive | 2002

Manufacture method for semiconductor inspection apparatus

Ryuji Kohno; Hideo Miura; Yoshishige Endo; Masatoshi Kanamaru; Atsushi Hosogane; Hideyuki Aoki; Naoto Ban

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