Brian P. Gaucher

SiGe bipolar transceiver circuits operating at 60 GHz

A low-noise amplifier, direct-conversion quadrature mixer, power amplifier, and voltage-controlled oscillators have been implemented in a 0.12-/spl mu/m, 200-GHz f/sub T/290-GHz f/sub MAX/ SiGe bipolar technology for operation at 60 GHz. At 61.5 GHz, the two-stage LNA achieves 4.5-dB NF, 15-dB gain, consuming 6 mA from 1.8 V. This is the first known demonstration of a silicon LNA at V-band. The downconverter consists of a preamplifier, I/Q double-balanced mixers, a frequency tripler, and a quadrature generator, and is again the first known demonstration of silicon active mixers at V-band. At 60 GHz, the downconverter gain is 18.6 dB and the NF is 13.3 dB, and the circuit consumes 55 mA from 2.7 V, while the output buffers consume an additional 52 mA. The balanced class-AB PA provides 10.8-dB gain, +11.2-dBm 1-dB compression point, 4.3% maximum PAE, and 16-dBm saturated output power. Finally, fully differential Colpitts VCOs have been implemented at 22 and 67 GHz. The 67-GHz VCO has a phase noise better than -98 dBc/Hz at 1-MHz offset, and provides a 3.1% tuning range for 8-mA current consumption from a 3-V supply.

A Silicon 60-GHz Receiver and Transmitter Chipset for Broadband Communications

A 0.13-mum SiGe BiCMOS double-conversion superheterodyne receiver and transmitter chipset for data communications in the 60-GHz band is presented. The receiver chip includes an image-reject low-noise amplifier (LNA), RF-to-IF mixer, IF amplifier strip, quadrature IF-to-baseband mixers, phase-locked loop (PLL), and frequency tripler. It achieves a 6-dB noise figure, -30 dBm IIP3, and consumes 500 mW. The transmitter chip includes a power amplifier, image-reject driver, IF-to-RF upmixer, IF amplifier strip, quadrature baseband-to-IF mixers, PLL, and frequency tripler. It achieves output P1dB of 10 to 12dBm, Psat of 15 to 17 dBm, and consumes 800 mW. The chips have been packaged with planar antennas, and a wireless data link at 630 Mb/s over 10 m has been demonstrated

A chip-scale packaging technology for 60-GHz wireless chipsets

In this paper, we present a cost-effective chip-scale packaging solution for a 60-GHz industrial-scientific-medical band receiver (Rx) and transmitter (Tx) chipset capable of gigabit-per-second wireless communications. Envisioned applications of the packaged chipset include 1-3-Gb/s directional links using amplitude shift-keying or phase shift-keying modulation and 500-Mb/s-1-Gb/s omni-directional links using orthogonal frequency-division multiplexing modulation. This paper demonstrates the first fully package-integrated 60-GHz chipset including receive and transmit antennas in a cost-effective plastic package. A direct-chip-attach (DCA) and surface mountable land-grid-array (LGA) package technology is presented. The size of the DCA package is 7times11 mm2 and the LGA package size is 6times13 mm2. Optionally, the Tx and Rx chip can be packaged together with Tx and Rx antennas in a combined 13times13 mm2 LGA transceiver package

Wide band AC power line characterization

This paper presents data characterizing the household AC power line in the 1-60 MHz band. Two types of measurements were performed: transmission and noise sampling. The transmission measurements were done by using the impulse channel sounding method, so both the line attenuation and the delay spread were obtained. The noise measurements include: power line background noise, appliance noise, and noise sampled over a 24 hour period. Statistical characteristics of the delay spread, frequency response and noise can be extracted from the data and used in the design of AC power line based communications systems.

Broadband Planar Superstrate Antenna for Integrated Millimeterwave Transceivers

In this paper, a new planar superstrate antenna concept suitable for integration with millimeter wave (mmWave) transceiver integrated circuits (ICs) is presented. The antenna is printed on the bottom of a dielectric superstrate with a ground plane below. The new design provides high bandwidth and high efficiency. Two different examples of the new concept have been designed and manufactured for the 60 GHz industrial scientific medical (ISM) band using folded dipoles. Simulated and measured input impedance matching and far field radiation patterns for both antennas will be shown and discussed. Both designs achieve over 10% bandwidth while maintaining better than 80% efficiency

Integration of Yagi Antenna in LTCC Package for Differential 60-GHz Radio

A Yagi antenna implemented in a thin cavity-down ceramic ball grid array package in low temperature cofired ceramic (LTCC) technology is reported. The antenna, intended for use in highly integrated differential 60-GHz radios, has achieved a 10-dB impedance bandwidth of 2.3 GHz from 60.6 to 62.9 GHz and a peak gain of 6 dBi at 62 GHz.

Probe based MMW antenna measurement setup

A MMW setup is presented for measuring complex impedance and radiation patterns in an anechoic chamber while contacting the antenna with a coplanar probe. Measurement and simulation results of a 60 GHz Vivaldi antenna are shown to demonstrate the setup performance.

Developing integrated antenna subsystems for laptop computers

The design, development, testing, and integration methodology for antennas integrated into laptop computers is described. Two key parameters are proposed and discussed for laptop antenna design and evaluation: standing wave ratio (SWR) and average antenna gain. A novel averaging technique was developed and applied to these to yield a measurable, repeatable, and generalized metric. A prototype antenna was built using this methodology, and measurements indicate that the resulting design attains both performance and cost targets. A PC-card-version wireless system is also discussed and compared with the integrated one. The impact of the antenna on the overall wireless system is studied through a link budget model.

Wideband Cavity-backed Folded Dipole Superstrate Antenna for 60 GHz Applications

The wideband and high efficiency folded dipole antenna for 60 GHz applications with the integration capability in a low-cost plastic packaging technology was presented. The proximity of the cavity metal walls was used in an input impedance bandwidth enhancement process. Moreover, the metal cavity has the potential to make the antenna performance to a large extend insensitive to the surrounding package and PCB-level dielectric and metal structures. The antenna performance showed an extremely low sensitivity to the cavity manufacturing and attachment tolerances which is of special importance at mm-wave frequencies. The ideas presented in this paper are patent pending

Determination of the complex permittivity of packaging materials at millimeter-wave frequencies

The focus of this paper is the determination of the complex permittivity of chip packaging materials at millimeter-wave frequencies. After a broad overview of existing measurement techniques, three methods will be presented that have been established for the dielectric property determination of substrate, as well as mold materials (encapsulants, under-fill, etc.) in the millimeter-wave frequency range. First, the open resonator used here will be briefly described. It allows accurate determination of the dielectric constant and loss of thin sheet substrate materials from below 20 GHz to above 100 GHz. Second, a filled waveguide method is explained in detail. The setup used here can determine the complex dielectric properties of mold materials from 70 to 100 GHz. Third, the method based on covered transmission lines will be described in detail. The used lines allow measurements from below 40 GHz to approximately 90 GHz. Verification of all three methods will be provided by inter-comparison and comparison to values from the literature. Additionally, results for several typical substrate and mold materials that are available for millimeter-wave packaging will be shown and discussed.