Duixian Liu

A Fully Integrated 16-Element Phased-Array Transmitter in SiGe BiCMOS for 60-GHz Communications

A fully-integrated 16-element 60-GHz phased-array receiver is implemented in IBM 0.12-μm SiGe BiCMOS technology. The receiver employs RF-path phase-shifting and is designed for multi-Gb/s non-line of sight links in the 60-GHz ISM band (IEEE 802.15.3c and 802.11ad). Each RF front-end includes variable-gain LNAs and phase shifters with each front-end capable of 360° variable phase shift (11.25° phase resolution) from 57 GHz to 66 GHz with coarse/fine gain steps. A detailed analysis of the noise trade-offs in the receiver array design is presented to motivate architectural choices. The hybrid active and passive signal-combining network in the receiver uses a differential cross-coupled Gysel power combiner that reduces combiner loss and area. Each array front-end has 6.8-dB noise figure (at 22°C ) and the array has -10 dB to 58 dB programmable gain from single-input to output. Sixteen 60-GHz aperture-coupled patch-antennas and the RX IC are packaged together in multi-layer organic and LTCC packages. The packaged RX IC is capable of operating in all four IEEE 802.15.3c channels (58.32 to 64.8 GHz). Beam-forming and beam-steering measurements show good performance with 50-ns beam switching time. 5.3-Gb/s OFDM 16-QAM and 4.5 Gb/s SC 16-QAM links are demonstrated using the packaged RX ICs. Both line-of-sight links (~7.8 m spacing) and non-line-of-sight links using reflections (~9 m total path length) have been demonstrated with better than -18 dB EVM. The 16-element receiver consumes 1.8 W and occupies 37.7 mm2 of die area.

A chip-scale packaging technology for 60-GHz wireless chipsets

In this paper, we present a cost-effective chip-scale packaging solution for a 60-GHz industrial-scientific-medical band receiver (Rx) and transmitter (Tx) chipset capable of gigabit-per-second wireless communications. Envisioned applications of the packaged chipset include 1-3-Gb/s directional links using amplitude shift-keying or phase shift-keying modulation and 500-Mb/s-1-Gb/s omni-directional links using orthogonal frequency-division multiplexing modulation. This paper demonstrates the first fully package-integrated 60-GHz chipset including receive and transmit antennas in a cost-effective plastic package. A direct-chip-attach (DCA) and surface mountable land-grid-array (LGA) package technology is presented. The size of the DCA package is 7times11 mm2 and the LGA package size is 6times13 mm2. Optionally, the Tx and Rx chip can be packaged together with Tx and Rx antennas in a combined 13times13 mm2 LGA transceiver package

Wide band AC power line characterization

This paper presents data characterizing the household AC power line in the 1-60 MHz band. Two types of measurements were performed: transmission and noise sampling. The transmission measurements were done by using the impulse channel sounding method, so both the line attenuation and the delay spread were obtained. The noise measurements include: power line background noise, appliance noise, and noise sampled over a 24 hour period. Statistical characteristics of the delay spread, frequency response and noise can be extracted from the data and used in the design of AC power line based communications systems.

Broadband Planar Superstrate Antenna for Integrated Millimeterwave Transceivers

In this paper, a new planar superstrate antenna concept suitable for integration with millimeter wave (mmWave) transceiver integrated circuits (ICs) is presented. The antenna is printed on the bottom of a dielectric superstrate with a ground plane below. The new design provides high bandwidth and high efficiency. Two different examples of the new concept have been designed and manufactured for the 60 GHz industrial scientific medical (ISM) band using folded dipoles. Simulated and measured input impedance matching and far field radiation patterns for both antennas will be shown and discussed. Both designs achieve over 10% bandwidth while maintaining better than 80% efficiency

Integration of Yagi Antenna in LTCC Package for Differential 60-GHz Radio

A Yagi antenna implemented in a thin cavity-down ceramic ball grid array package in low temperature cofired ceramic (LTCC) technology is reported. The antenna, intended for use in highly integrated differential 60-GHz radios, has achieved a 10-dB impedance bandwidth of 2.3 GHz from 60.6 to 62.9 GHz and a peak gain of 6 dBi at 62 GHz.

Packages With Integrated 60-GHz Aperture-Coupled Patch Antennas

This paper presents balanced-fed and fork-fed aperture-coupled patch antennas and 16-element arrays suitable for broadband millimeter-wave communications. The antennas are realized in a multi-layer organic package structure, to which RF integrated circuits can be integrated. To improve antenna bandwidth and radiation efficiency, an air cavity is used, resulting in a superstrate planar patch-antenna structure. Additionally, resonating apertures are used to further increase the antenna bandwidth. Measured results at 60 GHz for the antennas show good performance in terms of peak gain (about 8 dBi for a single element and 17 dBi for a 16-element array), bandwidth ( >; 10 GHz for 10-dB return loss bandwidths are achievable), and radiation efficiency (80% for single-element from simulation).

LTCC Packages With Embedded Phased-Array Antennas for 60 GHz Communications

A low-cost, fully-integrated antenna-in-package solution for 60 GHz phased-array systems is demonstrated. Sixteen patch antennas are integrated into a 28 mm × 28 mm ball grid array together with a flip-chip attached transmitter or receiver IC. The packages have been implemented using low temperature co-fired ceramic technology. 60 GHz interconnects, including flip-chip transitions and via structures, are optimized using full-wave simulation. Anechoic chamber measurement has shown ~ 5 dBi unit antenna gain across all four IEEE 802.15.3c channels, achieving excellent model-to-hardware correlation. The packaged transmitter and receiver ICs, mounted on evaluation boards, have demonstrated beam-steered, non-line-of-sight links with data rates up to 5.3 Gb/s.

Probe based MMW antenna measurement setup

A MMW setup is presented for measuring complex impedance and radiation patterns in an anechoic chamber while contacting the antenna with a coplanar probe. Measurement and simulation results of a 60 GHz Vivaldi antenna are shown to demonstrate the setup performance.

Developing integrated antenna subsystems for laptop computers

The design, development, testing, and integration methodology for antennas integrated into laptop computers is described. Two key parameters are proposed and discussed for laptop antenna design and evaluation: standing wave ratio (SWR) and average antenna gain. A novel averaging technique was developed and applied to these to yield a measurable, repeatable, and generalized metric. A prototype antenna was built using this methodology, and measurements indicate that the resulting design attains both performance and cost targets. A PC-card-version wireless system is also discussed and compared with the integrated one. The impact of the antenna on the overall wireless system is studied through a link budget model.

Organic Packages With Embedded Phased-Array Antennas for 60-GHz Wireless Chipsets

A multilayer organic package with embedded 60-GHz antennas and fully integrated with a 60-GHz phased-array transmitter or receiver chip is demonstrated. The package includes sixteen phased-array antennas, an open cavity for housing the flip-chip attached RF chip, and interconnects operating at DC-66 GHz. The 28 mm 28 mm ball grid array package is manufactured using printed circuit board processes and uses a combination of liquid-crystal polymer and glass-reinforced laminates, allowing excellent 60-GHz interconnect and antenna performance. The measured return loss and gain of each antenna from 56 to 66 GHz are and , respectively. Finally, the packaged transmitter and receiver chipsets, each working with a heat sink, have demonstrated beam-steered, non-line-of-sight links with data rates up to 5.3 Gb/s using 16-quadrature amplitude modulation single-carrier and orthogonal frequency division multiplexing schemes.