Byung Lyul Park
Samsung
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Publication
Featured researches published by Byung Lyul Park.
Solid State Phenomena | 2005
Ja Hyung Han; Ja Eung Koo; Duk Ho Hong; Byung Lyul Park; Seong Kim; Insoo Cho; Dae Hong Eom; Jin-Goo Park
Corrosion on specific Cu patterns was evaluated during Cu CMP. The corrosion was observed at isolated patterns and outer edge area of pad surrounded by oxide field after polishing and showed dependency on process. Two different commercial slurries were chosen and used for polishing after characterizing electrochemical and frictional properties. Stress simulations were conducted on these patterns. Higher stress was calculated on these patterns. The process temperature and friction behavior of Cu affected the magnitude of corrosion on Cu on these patterns.
Journal of Electronic Materials | 1997
Byung Lyul Park; Dae-hong Ko; Young Sun Kim; Jung Min Ha; Young Wook Park; Sang In Lee; Hyeon-deok Lee; Myoung Bum Lee; U. In Chung; Young Bum Koh; Moon Yong Lee
Archive | 2013
Pil-Kyu Kang; Taeyeong Kim; Byung Lyul Park; Jumyong Park; Jin-ho Park; Kyu-Ha Lee; Deok-Young Jung; Gil-heyun Choi
Archive | 2012
Ho-Jin Lee; Byung Lyul Park; Se-young Jeong; Hyun-Soo Chung; Gil-heyun Choi
Archive | 2012
Do-Sun Lee; Byung Lyul Park; Gil-heyun Choi; Kwang-jin Moon; Kun-Sang Park; Suk-Chul Bang; Seong-min Son
Archive | 2015
Pil-Kyu Kang; Byung Lyul Park; Taeyeong Kim; Yeun-Sang Park; Do-Sun Lee; Ho-Jin Lee; Jin-Ho Chun; Ju-Il Choi; Yi Koan Hong
Archive | 2014
Hyung-Jun Jeon; Byung Lyul Park; Ji-soon Park
Archive | 2013
Ho-Jin Lee; Pil-Kyu Kang; Taeyeong Kim; Byung Lyul Park; Kyu-Ha Lee; Gil-heyun Choi
Archive | 2012
Ho-Jin Lee; Pil-Kyu Kang; Seok-Ho Kim; Byung Lyul Park; Kyu-Ha Lee; Hyun-Soo Chung; Gil-heyun Choi
Archive | 2015
Jeonggi Jin; Byung Lyul Park; Ji-soon Park; Suk-Chul Bang; Deok-Young Jung