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Featured researches published by Byung Lyul Park.


Solid State Phenomena | 2005

Effects of patterns on corrosion in Cu CMP

Ja Hyung Han; Ja Eung Koo; Duk Ho Hong; Byung Lyul Park; Seong Kim; Insoo Cho; Dae Hong Eom; Jin-Goo Park

Corrosion on specific Cu patterns was evaluated during Cu CMP. The corrosion was observed at isolated patterns and outer edge area of pad surrounded by oxide field after polishing and showed dependency on process. Two different commercial slurries were chosen and used for polishing after characterizing electrochemical and frictional properties. Stress simulations were conducted on these patterns. Higher stress was calculated on these patterns. The process temperature and friction behavior of Cu affected the magnitude of corrosion on Cu on these patterns.


Journal of Electronic Materials | 1997

Characteristics of PECVD grown tungsten nitride films as diffusion barrier layers for ULSI DRAM applications

Byung Lyul Park; Dae-hong Ko; Young Sun Kim; Jung Min Ha; Young Wook Park; Sang In Lee; Hyeon-deok Lee; Myoung Bum Lee; U. In Chung; Young Bum Koh; Moon Yong Lee


Archive | 2013

Semiconductor devices having through-vias and methods for fabricating the same

Pil-Kyu Kang; Taeyeong Kim; Byung Lyul Park; Jumyong Park; Jin-ho Park; Kyu-Ha Lee; Deok-Young Jung; Gil-heyun Choi


Archive | 2012

MICROELECTRONIC DEVICES HAVING CONDUCTIVE THROUGH VIA ELECTRODES INSULATED BY GAP REGIONS

Ho-Jin Lee; Byung Lyul Park; Se-young Jeong; Hyun-Soo Chung; Gil-heyun Choi


Archive | 2012

Semiconductor devices including through silicon via electrodes and methods of fabricating the same

Do-Sun Lee; Byung Lyul Park; Gil-heyun Choi; Kwang-jin Moon; Kun-Sang Park; Suk-Chul Bang; Seong-min Son


Archive | 2015

Semiconductor devices having hybrid stacking structures and methods of fabricating the same

Pil-Kyu Kang; Byung Lyul Park; Taeyeong Kim; Yeun-Sang Park; Do-Sun Lee; Ho-Jin Lee; Jin-Ho Chun; Ju-Il Choi; Yi Koan Hong


Archive | 2014

CARRIER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME

Hyung-Jun Jeon; Byung Lyul Park; Ji-soon Park


Archive | 2013

Wafer carrier having cavity

Ho-Jin Lee; Pil-Kyu Kang; Taeyeong Kim; Byung Lyul Park; Kyu-Ha Lee; Gil-heyun Choi


Archive | 2012

Semiconductor devices including protected barrier layers

Ho-Jin Lee; Pil-Kyu Kang; Seok-Ho Kim; Byung Lyul Park; Kyu-Ha Lee; Hyun-Soo Chung; Gil-heyun Choi


Archive | 2015

SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES CAPPED WITH SELF-ALIGNED PROTECTION LAYERS AND METHODS FOR FABRICATING SAME

Jeonggi Jin; Byung Lyul Park; Ji-soon Park; Suk-Chul Bang; Deok-Young Jung

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