Suk-Chul Bang

Semiconductor device and method of fabricating the same including a conductive structure is formed through at least one dielectric layer after forming a via structure

Stacked semiconductor device and related method

Integrated circuit device including through-silicon via structure and decoupling capacitor and method of manufacturing the same

Semiconductor devices including through silicon via electrodes and methods of fabricating the same

Integrated Circuit Devices Having Through Silicon Via Structures and Methods of Manufacturing the Same

Photoelectric Integrated Circuit Devices And Methods Of Forming The Same

Integrated circuit device having through-silicon-via structure and method of manufacturing the integrated circuit device

Electrode Connecting Structures Containing Copper

Integrated Circuit Devices Including a Through-Silicon Via Structure and Methods of Fabricating the Same

Method of fabricating CMOS transistor that prevents gate thinning