Ceredig Roberts

Trends in memory technology - reliability perspectives, challenges and opportunities

As DRAM and NAND cells are rapidly scaled deep into the nanoscale regime, meeting design and reliability requirements require deeper understanding of single-cell characteristics. Some of the challenges are common between these technologies while some are unique. New materials and cell structures are being introduced to address some of these issues and provide further scaling opportunities.

A Highly Reliable and Cost Effective 16nm Planar NAND Cell Technology

A 2D 16nm planar NAND cell technology is described with good cell to cell interference and reliability that can be used in a wide variety of applications. This second generation planar cell uses a high-K dielectric stack and a thin poly floating gate to maintain the needed gate coupling ratio and reduce adjacent cell interference. The technology includes select gates with the same planar structure as the cell. This select gate architecture simplifies the manufacturing of this NAND technology.