Cheryl J. Marshall

Review of displacement damage effects in silicon devices

This paper provides a historical review of the literature on the effects of radiation-induced displacement damage in semiconductor materials and devices. Emphasis is placed on effects in technologically important bulk silicon and silicon devices. The primary goals are to provide a guide to displacement damage literature, to offer critical comments regarding that literature in an attempt to identify key findings, to describe how the understanding of displacement damage mechanisms and effects has evolved, and to note current trends. Selected tutorial elements are included as an aid to presenting the review information more clearly and to provide a frame of reference for the terminology used. The primary approach employed is to present information qualitatively while leaving quantitative details to the cited references. A bibliography of key displacement-damage information sources is also provided.

Autonomous bit error rate testing at multi-gbit/s rates implemented in a 5AM SiGe circuit for radiation effects self test (CREST)

SEE testing at multi-Gbit/s data rates has traditionally involved elaborate high speed test equipment setups for at-speed testing. We demonstrate a generally applicable self test circuit approach implemented in IBMs 5AM SiGe process, and describe its ability to capture complex error signatures during circuit operation at data rates exceeding 5 Gbit/s. Comparisons of data acquired with FPGA control of the CREST ASIC versus conventional bit error rate test equipment validate the approach. In addition, we describe SEE characteristics of the IBM 5AM process implemented in five variations of the D flip-flop based serial register. Heavy ion SEE data acquired at angles follow the traditional RPP-based analysis approach in one case, but deviate by orders on magnitude in others, even though all circuits are implemented in the same 5AM SiGe HBT process.

Radiation effects on photonic imagers-a historical perspective

Photonic imagers are being increasingly used in space systems, where they are exposed to the space radiation environment. Unique properties of these devices require special considerations for radiation effects. This paper summarizes the evolution of radiation effects understanding in infrared detector technology, charge coupled devices, and active pixel sensors. The paper provides a discussion of key radiation effects developments and a view of the future of the technologies from a radiation effects perspective.

Emerging optocoupler issues with energetic particle-induced transients and permanent radiation degradation

Radiation-induced permanent degradation and single event transient effects for optocouplers are discussed in this paper. These two effects are independent to the first order and will be addressed separately. Displacement damage-induced degradation of optocoupler current transfer ratio is reviewed. New data are presented that show the importance of application specific testing and that generalized quantification of optocoupler CTR degradation can lead to incorrect predictions of actual circuit performance in a radiation environment. Data are given for various circuit loading and drive current parameters. Previous work that introduces the idea that two mechanisms exist for inducing transients on the optocoupler output is discussed. New data are presented that extends the evidence of this dual mechanism hypothesis. In this work measurements show that single event transient cross sections and transient propagation varies with circuit filtering. Finally, we discuss utilization of the optocouplers in the space environment. New data are applied to two examples: one on permanent degradation and the other on single event transient rates in high bandwidth applications.

Current single event effects and radiation damage results for candidate spacecraft electronics

We present data on the vulnerability of a variety of candidate spacecraft electronics to proton and heavy ion induced single event effects, proton-induced damage, and total ionizing dose. Devices tested include optoelectronics, digital, analog, linear bipolar, hybrid devices, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), and DC-DC converters, among others.

Energy dependence of proton damage in AlGaAs light-emitting diodes

We measure the energy dependence of proton-induced LED degradation using large numbers of devices and incremental exposures to gain high confidence in the proton energy dependence and device-to-device variability of damage. We compare single versus double heterojunction AlGaAs technologies (emitting at 880 nm and 830 nm, respectively) to previous experimental and theoretical results. We also present a critical review of the use of nonionizing energy loss in AlGaAs for predictions of on-orbit degradation and assess the uncertainties inherent in this approach.

Application of RHBD Techniques to SEU Hardening of Third-Generation SiGe HBT Logic Circuits

Shift registers featuring radiation-hardening-by-design (RHBD) techniques are realized in IBM 8HP SiGe BiCMOS technology. Both circuit and device-level RHBD techniques are employed to improve the overall SEU immunity of the shift registers. Circuit-level RHBD techniques include dual-interleaving and gated-feedback that achieve SEU mitigation through local latch-level redundancy and correction. In addition, register-level RHBD based on triple-module redundancy (TMR) versions of dual-interleaved and gated-feedback cell shift registers is also realized to gauge the performance improvement offered by TMR. At the device-level, RHBD C-B-E SiGe HBTs with single collector and base contacts and significantly smaller deep trench-enclosed area than standard C-B-E-B-C devices with dual collector and base contacts are used to reduce the upset sensitive area. The SEU performance of these shift registers was then tested using heavy ions and standard bit-error testing methods. The results obtained are compared to the unhardened standard shift register designed with CBEBC SiGe HBTs. The RHBD-enhanced shift registers perform significantly better than the unhardened circuit, with the TMR technique proving very effective in achieving significant SEU immunity

Proton-induced transients in optocouplers: in-flight anomalies, ground irradiation test, mitigation and implications

We present data on recent optocoupler in-flight anomalies and the subsequent ground test irradiation performed. Discussions of the single event mechanisms involved, transient filtering analysis, and design implications are included. Proton-induced transients were observed on higher speed optocouplers with a unique dependence on the incidence particle angle. The results indicate that both direct ionization and nuclear reaction-related mechanisms are responsible for the single events observed.

An Investigation of Dose Rate and Source Dependent Effects in 200 GHz SiGe HBTs

We present an investigation of the observed variations in the total dose tolerance of the emitter-base spacer and shallow trench isolation oxides in a commercial 200 GHz SiGe HBT technology. Proton, gamma, and X-ray irradiations at varying dose rates are found to produce drastically different degradation signatures at the various oxide interfaces. Extraction and analysis of the radiation-induced excess base current, as well as low-frequency noise, are used to probe the underlying physical mechanisms. Two-dimensional calibrated device simulations are employed to correlate the observed results to the spatial distributions of carrier recombination in forward- and inverse-mode operation for both pre- and post-irradiation levels. Possible explanations of our observations are offered and the implications for hardness assurance testing are discussed

A comparison of gamma and proton radiation effects in 200 GHz SiGe HBTs

We present the results of gamma irradiation on third-generation, 200 GHz SiGe HBTs. Pre- and post-radiation dc figures-of-merit are used to quantify the tolerance of the raised extrinsic base structure to Co-60 gamma rays for varying device geometries. Additionally, the impact of technology scaling on the observed radiation response is addressed through comparisons to second generation, 120 GHz SiGe HBTs. Comparisons to previous proton-induced degradation results in these 200 GHz SiGe HBTs are also made, and indicate that the STI isolation oxide of the device shows increased degradation following Co-60 irradiation. The EB spacer oxide, on the other hand, demonstrates increased susceptibility to proton damage. Low dose rate proton testing was also performed and indicate that although there is a proton dose rate effect present in these devices, it cannot fully explain the observed trends. Similar trends have previously been observed for buried oxides and isolation oxides in several MOS technologies and have been attributed to increased charge yield in these oxides for 1.2 MeV Co-60 gamma rays when compared to 63 MeV protons.