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Chi-Hsi Wu

TSMC

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Publication

Featured researches published by Chi-Hsi Wu.

Archive | 2013

3DIC Packaging with Hot Spot Thermal Management Features

Wensen Hung; Szu-Po Huang; Hsiang-Fan Lee; Kim Hong Chen; Chi-Hsi Wu; Shin-puu Jeng

Archive | 2013

Packages with Thermal Interface Material on the Sidewalls of Stacked Dies

Chen-Hua Yu; Wensen Hung; Szu-Po Huang; An-Jhih Su; Hsiang-Fan Lee; Kim Hong Chen; Chi-Hsi Wu; Shin-puu Jeng

Archive | 2016

INTEGRATED CIRCUIT PACKAGE PAD AND METHODS OF FORMING

Hsien-Wei Chen; Chen-Hua Yu; Chi-Hsi Wu; Der-Chyang Yeh; An-Jhih Su; Wei-Yu Chen

Archive | 2014

Package with Embedded Heat Dissipation Features

Wensen Hung; Szu-Po Huang; Hsiang-Fan Lee; Kim Hong Chen; Chi-Hsi Wu; Shin-puu Jeng

Archive | 2017

SMD/IPD ON PACKAGE OR DEVICE STRUCTURE AND METHODS OF FORMING

Cheng-Hsien Hsieh; Hsien-Wei Chen; Chi-Hsi Wu; Chen-Hua Yu; Der-Chyang Yeh; Wei-Cheng Wu

Archive | 2016

Methods of forming integrated circuit package

Chen-Hua Yu; Chi-Hsi Wu; Wen-Chih Chiou; Hsiang-Fan Lee; Shih-Peng Tai; Tang-jung Chiu

Archive | 2017

Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same

Chen-Hua Yu; An-Jhih Su; Wei-Yu Chen; Ying-Ju Chen; Tsung-Shu Lin; Chin-Chuan Chang; Hsien-Wei Chen; Wei-Cheng Wu; Der-Chyang Yeh; Li-Hsien Huang; Chi-Hsi Wu

Archive | 2017

Cooling Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices

Cheng-chieh Hsieh; Chi-Hsi Wu; Shin-puu Jeng; Tsung-yu Chen; Wensen Hung

Archive | 2017

Redistribution Layers in Semiconductor Packages and Methods of Forming Same

Cheng-Hsien Hsieh; Li-Han Hsu; Wei-Cheng Wu; Hsien-Wei Chen; Der-Chyang Yeh; Chi-Hsi Wu; Chen-Hua Yu

Archive | 2018

FAN-OUT STRUCTURE AND METHOD OF FABRICATING THE SAME

Chen-Hua Yu; An-Jhih Su; Chi-Hsi Wu; Der-Chyang Yeh; Hsien-Wei Chen; Wei-Yu Chen

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Collaboration

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Chen-Hua Yu

TSMC

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Der-Chyang Yeh

TSMC

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Hsien-Wei Chen

TSMC

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An-Jhih Su

TSMC

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Wei-Cheng Wu

TSMC

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Cheng-Hsien Hsieh

TSMC

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Hsiang-Fan Lee

TSMC

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Shin-puu Jeng

TSMC

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Wensen Hung

TSMC

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Kim Hong Chen

TSMC

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