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Wensen Hung

TSMC

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Publication

Featured researches published by Wensen Hung.

Archive | 2013

3DIC Packaging with Hot Spot Thermal Management Features

Wensen Hung; Szu-Po Huang; Hsiang-Fan Lee; Kim Hong Chen; Chi-Hsi Wu; Shin-puu Jeng

Archive | 2016

3DIC Package and Methods of Forming the Same

Kim Hong Chen; Szu-Po Huang; Shin-puu Jeng; Wensen Hung

Archive | 2016

3DIC packages with heat dissipation structures

Wensen Hung; Szu-Po Huang; Kim Hong Chen; Shin-puu Jeng

Archive | 2013

3DIC packages with heat sinks attached to heat dissipating rings

Wensen Hung; Szu-Po Huang; Kim Hong Chen; Shin-puu Jeng

Archive | 2013

Packages with Thermal Management Features for Reduced Thermal Crosstalk and Methods of Forming Same

Kim Hong Chen; Wensen Hung; Szu-Po Huang; Shin-puu Jeng

Archive | 2013

Packages with Thermal Interface Material on the Sidewalls of Stacked Dies

Chen-Hua Yu; Wensen Hung; Szu-Po Huang; An-Jhih Su; Hsiang-Fan Lee; Kim Hong Chen; Chi-Hsi Wu; Shin-puu Jeng

Archive | 2014

Package with Embedded Heat Dissipation Features

Wensen Hung; Szu-Po Huang; Hsiang-Fan Lee; Kim Hong Chen; Chi-Hsi Wu; Shin-puu Jeng

Archive | 2013

Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Cooling Packaged Semiconductor Devices

Kim Hong Chen; Wensen Hung; Szu-Po Huang; Shin-puu Jeng

Archive | 2017

Cooling Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices

Cheng-chieh Hsieh; Chi-Hsi Wu; Shin-puu Jeng; Tsung-yu Chen; Wensen Hung

Archive | 2016

Methods of Cooling Packaged Semiconductor Devices

Kim Hong Chen; Szu-Po Huang; Shin-puu Jeng; Wensen Hung

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Collaboration

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Shin-puu Jeng

TSMC

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Kim Hong Chen

TSMC

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Szu-Po Huang

TSMC

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Chi-Hsi Wu

TSMC

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Hsiang-Fan Lee

TSMC

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An-Jhih Su

TSMC

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Chen-Hua Yu

TSMC

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Cheng-chieh Hsieh

TSMC

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Tsung-yu Chen

TSMC

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