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Dive into the research topics where Ching-Jung Yang is active.

Publication


Featured researches published by Ching-Jung Yang.


Archive | 2011

Probe pad on a corner stress relief region in a semiconductor chip

Hsien-Wei Chen; Chung-Ying Yang; Ying-Ju Chen; Shih-Wei Liang; Ching-Jung Yang


Archive | 2015

Self-alignment Structure for Wafer Level Chip Scale Package

Yu-Chia Lai; Hsien-Ming Tu; Tung-Liang Shao; Hsien-Wei Chen; Chang-Pin Huang; Ching-Jung Yang


Archive | 2015

Metal Insulator Metal Capacitor and Method for Making the Same

Ching-Jung Yang; Tung-Liang Shao; Yu-Chia Lai


Archive | 2010

Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device

Tung-Liang Shao; Shih-Wei Liang; Ying-Ju Chen; Ching-Jung Yang; Hsien-Wei Chen; Hao-Yi Tsai; Mirng-Ji Lii; Chen-Hua Yu


Archive | 2016

MIM Capacitor and Method Forming the Same

Ching-Jung Yang; Chang-Pin Huang; Hsien-Ming Tu; Hao-Yi Tsai; Mirng-Ji Lii; Shih-Wei Liang; Yu-Chia Lai


Archive | 2011

SEAL RING STRUCTURE FOR INTEGRATED CIRCUIT CHIPS

Ching-Jung Yang; Yu-Wen Liu; Michael Shou-Ming Tong; Hsien-Wei Chen; Chung-Ying Yang; Tsung-Yuan Yu


Archive | 2017

Package with Solder Regions Aligned to Recesses

Ching-Jung Yang; Hsien-Wei Chen; Hsien-Ming Tu; Chang-Pin Huang; Yu-Chia Lai; Tung-Liang Shao


Archive | 2016

Hollow Metal Pillar Packaging Scheme

Chang-Pin Huang; Hsien-Ming Tu; Hsien-Wei Chen; Tung-Liang Shao; Ching-Jung Yang; Yu-Chia Lai


Archive | 2013

Reducing Delamination Between an Underfill and a Buffer layer in a Bond Structure

Ching-Jung Yang; Chang-Pin Huang; Tzuan-Horng Liu; Michael Shou-Ming Tong; Ying-Ju Chen; Tung-Liang Shao; Hsien-Wei Chen; Hao-Yi Tsai; Mirng-Ji Lii


Archive | 2013

Seal Ring Structure with Metal-Insulator-Metal Capacitor

Hsien-Wei Chen; Tung-Liang Shao; Ching-Jung Yang; Yu-Chia Lai; Hao-Yi Tsai; Tsung-Yuan Yu

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