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Tung-Liang Shao

TSMC

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Publication

Featured researches published by Tung-Liang Shao.

Archive | 2011

Apparatus and Methods for Forming Through Vias

Tung-Liang Shao; Chih-Hang Tung; Chen-Hua Yu; Hao-Yi Tsai; Mirng-Ji Lii; Da-Yuan Shih

Archive | 2014

Capacitor in Post-Passivation structures and methods of forming the same

Hao-Yi Tsai; Hsien-Wei Chen; Hung-Yi Kuo; Tung-Liang Shao; Ying-Ju Chen; Tsung-Yuan Yu; Jie Chen

Archive | 2013

Thermally enhanced structure for multi-chip device

Chen-Hua Yu; Chih-Hang Tung; Tung-Liang Shao

Archive | 2015

Self-alignment Structure for Wafer Level Chip Scale Package

Yu-Chia Lai; Hsien-Ming Tu; Tung-Liang Shao; Hsien-Wei Chen; Chang-Pin Huang; Ching-Jung Yang

Archive | 2013

Methods for forming through vias

Tung-Liang Shao; Chih-Hang Tung; Chen-Hua Yu; Hao-Yi Tsai; Mirng-Ji Lii; Da-Yuan Shih

Archive | 2015

Metal Insulator Metal Capacitor and Method for Making the Same

Ching-Jung Yang; Tung-Liang Shao; Yu-Chia Lai

Archive | 2010

Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device

Tung-Liang Shao; Shih-Wei Liang; Ying-Ju Chen; Ching-Jung Yang; Hsien-Wei Chen; Hao-Yi Tsai; Mirng-Ji Lii; Chen-Hua Yu

Archive | 2017

Package with Solder Regions Aligned to Recesses

Ching-Jung Yang; Hsien-Wei Chen; Hsien-Ming Tu; Chang-Pin Huang; Yu-Chia Lai; Tung-Liang Shao

Archive | 2016

Hollow Metal Pillar Packaging Scheme

Chang-Pin Huang; Hsien-Ming Tu; Hsien-Wei Chen; Tung-Liang Shao; Ching-Jung Yang; Yu-Chia Lai

Archive | 2013

Reducing Delamination Between an Underfill and a Buffer layer in a Bond Structure

Ching-Jung Yang; Chang-Pin Huang; Tzuan-Horng Liu; Michael Shou-Ming Tong; Ying-Ju Chen; Tung-Liang Shao; Hsien-Wei Chen; Hao-Yi Tsai; Mirng-Ji Lii

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Ching-Jung Yang

TSMC

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Hsien-Wei Chen

TSMC

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Hao-Yi Tsai

TSMC

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Chen-Hua Yu

TSMC

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Mirng-Ji Lii

TSMC

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Yu-Chia Lai

TSMC

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Chang-Pin Huang

TSMC

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Chih-Hang Tung

TSMC

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Ying-Ju Chen

TSMC

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Hsien-Ming Tu

TSMC

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