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Shih-Wei Liang

TSMC

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Publication

Featured researches published by Shih-Wei Liang.

Archive | 2017

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Shih-Wei Liang; Hsin-Yu Pan; Kai-Chiang Wu; Ching-Feng Yang; Ming-Kai Liu; Chia-Chun Miao

Archive | 2011

Probe pad on a corner stress relief region in a semiconductor chip

Hsien-Wei Chen; Chung-Ying Yang; Ying-Ju Chen; Shih-Wei Liang; Ching-Jung Yang

Archive | 2011

METHODS OF AND SEMICONDUCTOR DEVICES WITH BALL STRENGTH IMPROVEMENT

Tsung-Yuan Yu; Hsien-Wei Chen; Ying-Ju Chen; Shih-Wei Liang

Archive | 2014

UBM structures for wafer level chip scale packaging

Tsung-Yuan Yu; Hsien-Wei Chen; Ying-Ju Chen; Shih-Wei Liang

Archive | 2010

Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device

Tung-Liang Shao; Shih-Wei Liang; Ying-Ju Chen; Ching-Jung Yang; Hsien-Wei Chen; Hao-Yi Tsai; Mirng-Ji Lii; Chen-Hua Yu

Archive | 2016

MIM Capacitor and Method Forming the Same

Ching-Jung Yang; Chang-Pin Huang; Hsien-Ming Tu; Hao-Yi Tsai; Mirng-Ji Lii; Shih-Wei Liang; Yu-Chia Lai

Archive | 2011

BOND PAD STRUCTURE TO REDUCE BOND PAD CORROSION

Ying-Ju Chen; Hsien-Wei Chen; Tsung-Yuan Yu; Shih-Wei Liang

Archive | 2015

Polymer Layers Embedded with Metal Pads for Heat Dissipation

Hao-Hsiang Chuang; Shih-Wei Liang; Ching-Feng Yang; Kai-Chiang Wu; Hao-Yi Tsai; Chuei-Tang Wang; Chen-Hua Yu

Archive | 2013

METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING A POST-PASSIVATION INTERCONNECT STRUCTURE

Shih-Wei Liang; Hsien-Wei Chen; Ying-Ju Chen; Tsung-Yuan Yu; Mirng-Ji Lii

Archive | 2016

Integrated Circuit Underfill Scheme

Shih-Wei Liang; Chun-Lin Lu; Kai-Chiang Wu; Ching-Feng Yang; Ming-Kai Liu; Chia-Chun Miao; Yen-Ping Wang

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Collaboration

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Hsien-Wei Chen

TSMC

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Ying-Ju Chen

TSMC

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Hao-Yi Tsai

TSMC

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Tsung-Yuan Yu

TSMC

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Chen-Hua Yu

TSMC

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Ching-Jung Yang

TSMC

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Mirng-Ji Lii

TSMC

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Chang-Pin Huang

TSMC

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Ching-Feng Yang

TSMC

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Hsien-Ming Tu

TSMC

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