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Chon C. Lei

IBM

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Publication

Featured researches published by Chon C. Lei.

Archive | 1999

Plastic solder array using injection molded solder

Lannie R. Bolde; Peter A. Gruber; Chon C. Lei

Archive | 2000

Low temperature solder column attach by injection molded solder and structure formed

Peter A. Gruber; Lannie R. Bolde; Guy Paul Brouillette; James H. Covell; David Danovitch; Chon C. Lei

Archive | 2002

Method and apparatus for applying solder to an element on a substrate

Peter A. Gruber; Chon C. Lei

Archive | 1997

Process of removing flux residue from microelectronic components

Krishna G. Sachdev; Umar M. Ahmad; John U. Knickerbocker; Chon C. Lei

Archive | 2002

Semi-aqueous solvent cleaning of paste processing residue from substrates

Krishna G. Sachdev; James N. Humenik; Chon C. Lei; Glenn A. Pomerantz

Archive | 2002

Method of removing silicone polymer deposits from electronic components

Krishna G. Sachdev; Umar M. Ahmad; Chon C. Lei

Archive | 2001

Semi-aqueous solvent based method of cleaning rosin flux residue

Krishna G. Sachdev; Chon C. Lei; Demian M. Riccardi

Archive | 2004

METHOD AND STRUCTURE FOR SELECTIVE THERMAL PASTE DEPOSITION AND RETENTION ON INTEGRATED CIRCUIT CHIP MODULES

Tim H. Lee; Chon C. Lei; Donald J. Papae; Francis F. Szenher

Archive | 2001

Cleaning method to remove flux residue in electronic assembly

Krishna G. Sachdev; Chon C. Lei

Archive | 1997

Fixture and method for securing electronic modules during wet processing

Chon C. Lei; Lannie R. Bolde; Donn Allan Lord

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Collaboration

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Krishna G. Sachdev

IBM

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Lannie R. Bolde

IBM

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Peter A. Gruber

IBM

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Umar M. Ahmad

IBM

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Charles L. Reynolds

IBM

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David Danovitch

IBM

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Demian M. Riccardi

IBM

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Donald J. Papae

IBM

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Donn Allan Lord

IBM

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Ellyn M. Ingalls

IBM

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