Christof Streck

Technique for forming a dielectric interlayer above a structure including closely spaced lines

Increasing reliability of copper-based metallization structures in a microstructure device by using aluminum nitride

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

Metal cap layer with enhanced etch resistivity for copper-based metal regions in semiconductor devices

Increased Stability of a Complex Material Stack in a Semiconductor Device by Providing Fluorine Enriched Interfaces

METHODS OF FABRICATING A SEMICONDUCTOR IC HAVING A HARDENED SHALLOW TRENCH ISOLATION (STI)

Increased density of low-k dielectric materials in semiconductor devices by applying a uv treatment

Method of fabricating a metal cap layer with enhanced etch resistivity for copper-based metal regions in semiconductor devices

Method of manufracturing increasing reliability of copper-based metallization structures in a microstructure device by using aluminum nitride

Enhancing structural integrity and defining critical dimensions of metallization systems of semiconductor devices by using ALD techniques