Kai Frohberg

Technique for creating different mechanical stress in different channel regions by forming an etch stop layer having differently modified intrinsic stress

MICROSTRUCTURE DEVICE INCLUDING A METALLIZATION STRUCTURE WITH SELF-ALIGNED AIR GAPS BETWEEN CLOSELY SPACED METAL LINES

Method of creating a strained channel region in a transistor by deep implantation of strain-inducing species below the channel region

Technique for forming a passivation layer prior to depositing a barrier layer in a copper metallization layer

Technique for controlling mechanical stress in a channel region by spacer removal

Method for reducing resist poisoning during patterning of silicon nitride layers in a semiconductor device

TECHNIQUE FOR FORMING CONTACT INSULATION LAYERS AND SILICIDE REGIONS WITH DIFFERENT CHARACTERISTICS

Hybrid contact structure with low aspect ratio contacts in a semiconductor device

METHOD FOR REDUCING RESIST POISONING DURING PATTERNING OF STRESSED NITROGEN-CONTAINING LAYERS IN A SEMICONDUCTOR DEVICE

Technique for enhancing the fill capabilities in an electrochemical deposition process by edge rounding of trenches