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Dive into the research topics where Christopher F. Bevis is active.

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Featured researches published by Christopher F. Bevis.


Applied Physics Letters | 2013

Nanoclusters of MoO3−x embedded in an Al2O3 matrix engineered for customizable mesoscale resistivity and high dielectric strength

William M. Tong; Alan D. Brodie; Anil U. Mane; Fuge Sun; Francoise Kidwingira; Mark A. McCord; Christopher F. Bevis; Jeffrey W. Elam

We have synthesized a material consisting of conducting metal oxide (MoO3−x) nanoclusters embedded in a high-dielectric-strength insulator (Al2O3) matrix. The resistivity of this material can be customized by varying the concentration of the MoO3−x nanoclusters. The Al2O3 protects the MoO3−x from stoichiometry change, thus conserving the number of carriers and maintaining a high dielectric strength. This composite material is grown by atomic layer deposition, a thin film deposition technique suitable for coating 3D structures. We applied these atomic layer deposition composite films to our 3D electron-optical micro electrical mechanical systems devices and greatly improved their performance.


Proceedings of SPIE | 2014

The REBL DPG: recent innovations and remaining challenges

Allen Carroll; Luca Grella; Kirk Murray; Mark A. McCord; Paul Petric; William M. Tong; Christopher F. Bevis; Shy-Jay Lin; Tsung-Hsin Yu; Tze-Chiang Huang; T. P. Wang; Wen-Chuan Wang; Jaw-Jung Shin

Reflective electron-beam lithography (REBL) employs a novel device to impress pattern information on an electron beam. This device, the digital pattern generator (DPG), is an array of small electron reflectors, in which the reflectance of each mirror is controlled by underlying CMOS circuitry. When illuminated by a beam of low-energy electrons, the DPG is effectively a programmable electron-luminous image source. By switching the mirror drive circuits appropriately, the DPG can ‘scroll’ the image of an integrated circuit pattern across its surface; and the moving electron image, suitably demagnified, can be used to expose the resist-coated surface of a wafer or mask. This concept was first realized in a device suitable for 45 nm lithography demonstrations. A next-generation device has been designed and is presently nearing completion. The new version includes several advances intended to make it more suitable for application in commercial lithography systems. We will discuss the innovations and compromises in the design of this next-generation device. For application in commercially-practical maskless lithography at upcoming device nodes, still more advances will be needed. Some of the directions in which this technology can be extended will be described.


Journal of Micro-nanolithography Mems and Moems | 2013

Digital pattern generator: an electron-optical MEMS for massively parallel reflective electron beam lithography

Luca Grella; Allen Carroll; Kirk Murray; Mark A. McCord; William M. Tong; Alan D. Brodie; Thomas Gubiotti; Fuge Sun; Francoise Kidwingira; Shinichi Kojima; Paul Petric; Christopher F. Bevis; Bart Vereecke; Luc Haspeslagh; Anil U. Mane; Jeffrey W. Elam

Abstract. The digital pattern generator (DPG) is a complex electron-optical MEMS that pixelates the electron beam in the reflective electron beam lithography (REBL) e-beam column. It potentially enables massively parallel printing, which could make REBL competitive with optical lithography. The development of the REBL DPG, from the CMOS architecture, through the lenslet modeling and design, to the fabrication of the MEMS device, is described in detail. The imaging and printing results are also shown, which validate the pentode lenslet concept and the fabrication process.


Archive | 2003

Systems for inspection of patterned or unpatterned wafers and other specimen

Christopher F. Bevis; Mike Kirk; Mehdi Vaez-Iravani


Archive | 1993

Surface scanner with thin film gauge

Kenneth P. Gross; George Kren; Christopher F. Bevis


Archive | 2001

Design driven inspection or measurement for semiconductor using recipe

Christopher F. Bevis


Archive | 2004

Apparatus and method for detecting overlay errors using scatterometry

Walter D. Mieher; Ady Levy; Boris Golovanesky; Michael Friedmann; Ian Smith; Michael E. Adel; Anatoly Fabrikant; Christopher F. Bevis; Noah Bareket; Kenneth P. Gross; Piotr Zalicki; Dan Wack; Paola Dececco; Thaddeus Gerard Dziura; Mark Ghinovker


Archive | 2007

Methods and systems for determining a characteristic of a wafer

Michael D. Kirk; Christopher F. Bevis; David L. Adler; Kris Bhaskar


Archive | 2006

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

Kurt Lehman; Charles Chen; Ronald L. Allen; Robert Shinagawa; Anantha Sethuraman; Christopher F. Bevis; Thanassis Trikas; Haiguang Chen; Ching Ling Meng


Archive | 2003

Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad

Kurt Lehman; Charles Chen; Ronald L. Allen; Robert Shinagawa; Anantha Sethuraman; Christopher F. Bevis; Thanassis Trikas; Haiguang Chen; Ching Ling Meng

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