Chung-Yu Hung

Design of an RF Transmit/Receive Switch Using LDMOSFETs With High Power Capability and Low Insertion Loss

This paper presents, for the first time, the study of the application of a lateral diffused metal-oxide-semiconductor field-effect transistor (LDMOSFET) in a common-gate configuration to radio-frequency (RF) transmit/receive (T/R) switching circuits. A single-pole double-throw (SPDT) 900-MHz T/R switch is implemented using 0.25-LDMOSFET foundry technology. Measured results show that our switching circuit can achieve a low insertion loss of 0.82 dB and a high power handling capability of 27 dBm. This result is promising in integrating power management integrated circuits, RF power amplifiers, and switching circuits in a single chip, based on LDMOSFET technology, to realize an RF transmit front-end system-on-chip solution.

Response surface methodology applied to silicon trench etching in Cl2/HBr/O2 using transformer coupled plasma technique

Abstract The response surface methodology (RSM) has been used in this study to investigate the effect of various control factors on the performance of silicon trench etch in high-density transformer coupled plasma (TCP) on Cl 2 /HBr/O 2 -based chemistry. The TCP source power, bias power, and Cl 2 content of the Cl 2 /HBr mixture were the process variables. The etch rate and sidewall profile angle were employed as the response items for RSM analysis. Quantitative relationships between etching characteristics and process parameters have been established. The possible mechanisms are also proposed to explain the different sidewall profile angles as varying the parameters.

Improving the Electrostatic Discharge Robustness of a Junction Barrier Schottky Diode Using an Embedded p-n-p BJT

The high-voltage (H-V) junction barrier Schottky (JBS) diode is often incorporated into the input or output of H-V integrated circuits. When the chip is connected to the external environment, it inevitably suffers electrostatic discharge (ESD) stress. However, the JBS diode can only withstand the forward-mode ESD but it is highly vulnerable to reverse-mode ESD. In this letter, a new kind of JBS diode that is incorporated with a p-n-p bipolar is developed. The experimental results demonstrated that the new device can improve the failure threshold voltages of the human body mode and machine mode by at least four times. The area increase for the new device is 2.2%.

Using LV process to design high voltage DDDMOSFET and LDMOSFET with 3-D profile structure

In this work, layout skills using three dimensional (3D) fish bone, slot, and island patterns to enhance the breakdown voltage of PW/NW junction of lateral MOSFETs is developed. Novel lateral double diffused MOSFETs (LDMOSFET) and Double Diffused Drain MOSFETs (DDDMOSFET) without any high voltage (HV) layer are achieved in a standard 5V low voltage (LV) CMOS technology. From the experiment results, the developed DDDMOSFETs and LDMOSFETs can be used for 10V and 60V application respectively.

Robust ESD self-protected LDNMOSFET by an enhanced displacement-current triggering

A new enhanced displacement-current triggering by adding floating P+ diffusions at each source finger edge for the HV LDNMOSFET is proposed. Unlike the conventional substrate-triggered ESD protection technologies, it is very easy to implement the scheme by the layout without any special circuit and additional component. With a total width of 1600 μm, the HBM/ MM ESD performance improvements from 1.5 kV/ 150 V to 5.5 kV/ 450 V are achieved.

The Study of the Electrothermal Property of High-Voltage Drain-Extended MOSFETs

In this paper, the relation between the surface electric field and the temperature distribution dependence on the drift-region doping concentration in a 30-V asymmetric drain-extended MOSFET is studied. For the case of high drift-region concentration, the drain resistance is low, and the current density is high, which induces a high nonuniform temperature distribution in the transistor, which in turn reduces the carrier mobility and causes a negative drain resistance. For the case of low drift-region concentration, a uniform temperature distribution is obtained. However, the different drift-region concentration changes the location of the maximum temperature from the gate-overlapped drift region for the high concentration case to the drain-side contact region for the low concentration case under the high VGS and VDS conditions. Therefore, the self-heating effect is also changed by the redistribution of the electric field in the drift region.