Daisuke Kawase

A Trench-Gate High-Conductivity IGBT (HiGT) With Short-Circuit Capability

This paper describes a new 600-V trench-gate high-conductivity insulated gate bipolar transistor (trench HiGT) that has both a low collector-emitter saturation voltage of 1.55 V at 200 and a tough short-circuit capability of more than 10 . The trench HiGT also has better tradeoff relationship between turn-off switching loss and collector-emitter saturation voltage compared to either an insulated gate bipolar transistor (IGBT) with a planar gate or a conventional trench gate. A reverse transfer capacitance that is 50% lower than that of the planar-gate IGBT and an input capacitance that is 40% lower than that of a conventional trench gate IGBT have been obtained for the trench HiGT.

Novel 600-V trench high-conductivity IGBT (Trench HiGT) with short-circuit capability

This paper describes new 600-V trench high-conductivity IGBTs (trench HiGTs) that have lower on-state voltages of 1.42 and 1.55 V at 200 A/cm/sup 2/ and tough short-circuit capabilities of 5 and 10 /spl mu/s, respectively. These HiGT have a better trade-off between turn-off losses and on-state voltages than conventional trench IGBTs, even better than planar IGBTs. They also offer a lower reverse transfer capacitances (-50%) than the planar IGBT. The input capacitance obtained were lower (-30% to -60%) than that of a conventional trench IGBT.

Suppression of reverse recovery ringing 3.3kV/450A Si/SiC hybrid in low internal inductance package: Next high power density dual; nHPD2

Suppression of reverse recovery ringing from 3.3kV Si-IGBT SiC Schottky barrier diode hybrid was verified. Reducing loop inductance, consisting of internal module, busbar connection and capacitor, is effective. To realize low inductance within the module and external connection with busbar, the gap between p and n terminal is minimized whilst maintaining the creepage and clearance required by regulation standards. Functional isolation is adopted instead of basic isolation. We achieved an inductance value 9nH for a 3.3kV, 450A dual IGBT, that leads to the extinction of reverse recovery oscillation. Details of switching characteristics of Si + SiC hybrid module is compared with that of Si IGBT module with low inductance.

Suppression of self-excited oscillation for common package of Si-IGBT and SiC-MOS

We propose a method to design a module structure avoiding the risk of self-excited (SE) oscillation. By simplifying both the semiconductor device and lumped circuit model, oscillatory conditions can be extracted analytically. Results show good agreement with T-CAD simulation and measurement results of test modules. The method is applied to the design of next generation common package, which has realized very low system inductance. SE oscillation can be prevented for latest generation Si-IGBTs having very small feedback capacitance and SiC-MOS having high output capacitance mounted in the same common package design.

High power density side-gate HiGT modules with sintered Cu having superior high-temperature reliability to sintered Ag

In this study, sintered Cu is shown to have superior reliability to that of sintered Ag, in a high-temperature thermal cycle test up to 200°C and superior power cycle durability at a maximum junction temperature of 175°C. A 1700 V low-stray-inductance dual module made with sintered Cu and a leading-edge side-gate HiGT (High-conductivity IGBT) is also shown to have high power density with low loss and ten times higher power cycle durability compared with Pb-rich solder.