David A. J. Moran

50-nm T-gate metamorphic GaAs HEMTs with f/sub T/ of 440 GHz and noise figure of 0.7 dB at 26 GHz

GaAs-based transistors with the highest f/sub T/ and lowest noise figure reported to date are presented in this letter. A 50-nm T-gate In/sub 0.52/Al/sub 0.48/As/In/sub 0.53/Ga/sub 0.47/As metamorphic high-electron mobility transistors (mHEMTs) on a GaAs substrate show f/sub T/ of 440 GHz, f/sub max/ of 400 GHz, a minimum noise figure of 0.7 dB and an associated gain of 13 dB at 26 GHz, the latter at a drain current of 185 mA/mm and g/sub m/ of 950 mS/mm. In addition, a noise figure of below 1.2 dB with 10.5 dB or higher associated gain at 26 GHz was demonstrated for drain currents in the range 40 to 470 mA/mm at a drain bias of 0.8 V. These devices are ideal for low noise and medium power applications at millimeter-wave frequencies.

Surface transfer doping of diamond by MoO3 : a combined spectroscopic and Hall measurement study

Surface transfer doping of diamond has been demonstrated using MoO3 as a surface electron acceptor material. Synchrotron-based high resolution photoemission spectroscopy reveals that electrons are transferred from the diamond surface to MoO3, leading to the formation of a sub-surface quasi 2-dimensional hole gas within the diamond. Ex-situ electrical characterization demonstrated an increase in hole carrier concentration from 1.00 × 1013/cm2 for the air-exposed hydrogen-terminated diamond surface to 2.16 × 1013/cm2 following MoO3 deposition. This demonstrates the potential to improve the stability and performance of hydrogen-terminated diamond electronic devices through the incorporation of high electron affinity transition metal oxides.

High Mobility III-V MOSFETs For RF and Digital Applications

Developments over the last 15 years in the areas of materials and devices have finally delivered competitive III-V MOSFETs with high mobility channels. This paper briefly reviews the above developments, discusses properties of the GdGaO/ Ga2O3 MOS systems, presents GaAs MOSFET DC and RF data, and concludes with an outlook for high indium content channel MOSFETs. GaAs based MOSFETs are potentially suitable for RF power amplification, switching, and front-end integration in mobile and wireless applications while MOSFETs with high indium content channels are of interest for future CMOS applications.

Hydrogen-Terminated Diamond Field-Effect Transistors With Cutoff Frequency of 53 GHz

Homoepitaxial diamond has been used to demonstrate the RF performance of 50-nm gate length hydrogen-terminated diamond field-effect transistors. An extrinsic cutoff frequency of 53 GHz is achieved which we believe to be the highest value reported for a diamond-based transistor. The generation of an RF small signal equivalent circuit is used to extract device elements to better understand variation between intrinsic and extrinsic operation. An intrinsic cutoff frequency of 90 GHz is extracted through this process, verifying the requirement to minimize access resistance to maximize the potential high-frequency performance of this technology.

Scaling of Hydrogen-Terminated Diamond FETs to Sub-100-nm Gate Dimensions

We present the dc operation of hydrogen-terminated diamond field-effect transistors (FETs) with gate lengths of 1 μm to 50 nm. The 50-nm device metrics include a maximum drain current of 290 mA/mm and a peak extrinsic transconductance of 95 mS/mm. As the device gate length is reduced, peak intrinsic transconductance is increased substantially to a value of 650 mS/mm for the 50-nm device. A minimum Ion/Ioff ratio of ~ 1.5 × 104 is maintained at this reduced gate dimension. These results appear highly promising for the improvement of hydrogen-terminated diamond FET high-frequency performance through reduction of the device gate length to sub-100-nm dimensions.

Enhanced surface transfer doping of diamond by V2O5 with improved thermal stability

Surface transfer doping of hydrogen-terminated diamond has been achieved utilising V2O5 as a surface electron accepting material. Contact between the oxide and diamond surface promotes the transfer of electrons from the diamond into the V2O5 as revealed by the synchrotron-based high resolution photoemission spectroscopy. Electrical characterization by Hall measurement performed before and after V2O5 deposition shows an increase in hole carrier concentration in the diamond from 3.0 × 1012 to 1.8 × 1013 cm−2 at room temperature. High temperature Hall measurements performed up to 300 °C in atmosphere reveal greatly enhanced thermal stability of the hole channel produced using V2O5 in comparison with an air-induced surface conduction channel. Transfer doping of hydrogen-terminated diamond using high electron affinity oxides such as V2O5 is a promising approach for achieving thermally stable, high performance diamond based devices in comparison with air-induced surface transfer doping.

Fabrication of ultrashort T gates using a PMMA/LOR/UVIII resist stack

In this article, we report a procedure for the fabrication of ultrashort T gates using high resolution electron beam lithography and a PMMA/LOR/UVIII resist stack. The intermediate lift-off resist (LOR) layer improves the quality of gate lithography, and consequently, device yields. It is unaffected by wet chemical gate recessing procedures and we report the application of the procedure to the fabrication of pseudomorphic and metamorphic high electron mobility transistors (pHEMTs) with 50 nm T gates. Fabricated pHEMTs had a gm of 600 mS/mm and ft of 200 GHz. Metamorphic HEMTs had a gm of 1500 mS/mm and ft of 350 GHz. We believe these are the fastest transistors of their kind in the world.

Monte Carlo Simulations of High-Performance Implant Free In

The potential performance of implant free heterostructure In0.3Ga0.7As channel MOSFETs with gate lengths of 30, 20, and 15 nm is investigated using state-of-the-art Monte Carlo (MC) device simulations. The simulations are carefully calibrated against the electron mobility and sheet density measured on fabricated III-V MOSFET structures with a high-kappa dielectric. The MC simulations show that the 30 nm gate length implant free MOSFET can deliver a drive current of 2174 muA/mum at 0.7 V supply voltage. The drive current increases to 2542 muA/mum in the 20 nm gate length device, saturating at 2535 muA/mum in the 15 nm gate length one. When quantum confinement corrections are included into MC simulations, they have a negligible effect on the drive current in the 30 and 20 nm gate length transistors but lower the 15 nm gate length device drive current at 0.7 V supply voltage by 10%. When compared to equivalent Si based MOSFETs, the implant free heterostructure MOSFETs can deliver a very high performance at low supply voltage, making them suitable for low-power high-performance CMOS applications

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T-gates are commonly used in high frequency low noise transistors on III–V materials since they provide a combination of short gate length and low gate resistance. Nanoimprint lithography can produce minimum pattern feature sizes equivalent to those attainable by high resolution electron beam lithography and it has potential advantages in terms of speed and cost. The imprint lithography step must be reliable and compatible with existing device process flows. In this article we describe a bilayer resist imprinting procedure for the fabrication of 120 nm T-gates for high electron mobility transistors. The results of transistor dc characterization are also presented and are similar to those obtained for transistors fabricated on the same material with gates realized by electron beam lithography.

Ga

Three sets of different gate-length field-effect transistors (250, 120, and 50 nm) have been defined on homoepitaxial hydrogen-terminated diamond with the 50-nm device being the smallest gate length diamond transistor fabricated to date. DC- and small-signal RF measurements were undertaken to compare the operation of these gate nodes. RF small-signal equivalent circuits were generated to contrast individual components and better understand the operation at various gate dimensions. Scaling the gate length to smaller dimensions leads to an increase in the cutoff frequency of these devices although parasitic elements are found to dominate at the shortest gate length of 50 nm, limiting the outstanding potential of these devices.