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Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where George H. Thiel is active.

Publication


Featured researches published by George H. Thiel.


Archive | 2001

High performance chip packaging and method

Timothy F. Carden; Glenn O. Dearing; Kishor V. Desai; Stephen Robert Engle; Randall J. Stutzman; George H. Thiel


Archive | 2004

Structure to accommodate increase in volume expansion during solder reflow

David V. Caletka; Krishna Darbha; Donald W. Henderson; Lawrence P. Lehman; George H. Thiel


Archive | 1998

Thermal/electrical break for printed circuit boards

Bruce J. Chamberlin; Mitchell G. Ferrill; Randall J. Stutzman; George H. Thiel


Archive | 2002

Semiconductor chip module and method of manufacture of same

William Infantolino; Voya R. Markovich; Sanjeev B. Sathe; George H. Thiel


Archive | 2004

Method of accommodating in volume expansion during solder reflow

David V. Caletka; Krishna Darbha; Donald W. Henderson; Lawrence P. Lehman; George H. Thiel


Journal of Electronic Materials | 2004

Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates

Tia-Marje K. Korhonen; Pekka Turpeinen; Lawrence Lehman; Brian Bowman; George H. Thiel; Raymond C. Parkes; Mattt A. Korhonen; Donald W. Henderson; Karl J. Puttlitz


Archive | 2003

Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls

George H. Thiel


Archive | 2004

Non-planar surface for semiconductor chips

William L. Brodsky; Sanjeev B. Sathe; George H. Thiel


Archive | 2002

Negative volume expansion lead-free electrical connection

David V. Caletka; Krishna Darbha; Donald W. Henderson; Lawrence P. Lehman; George H. Thiel


Archive | 1995

Integrated circuit package including a heat sink and an adhesive

David L. Questad; Anne M. Quinn; George H. Thiel; Donna Jean Trevitt; Tien Yue Wu; Patrick Robert Zippetelli

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