Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by Deepak C. Sekar.
international electron devices meeting | 2012
Hai Wei; Tony F. Wu; Deepak C. Sekar; Brian Cronquist; R. F. W. Pease; Subhasish Mitra
Our comprehensive analysis, over a range of 3D integration methods and application power density characteristics, quantifies major benefits of PDNs on the temperature distribution of 3D ICs. For example, PDNs can reduce the maximum steady-state temperature by over 35 °C for a 2-layer monolithic 3D IC. Our OpenSPARC T2 case study also demonstrates that the cooling benefits of PDNs are essential to achieve monolithic 3D integration. Our analysis framework can be adopted for exploring technology-circuit-application interactions for a wide variety of 3D technologies, cooling options, PDN designs, or even software-level task scheduling approaches. Of course, it is essential to experimentally validate the simulation results presented in this paper.
Archive | 2010
Zvi Or-Bach; Brian Cronquist; Israel Beinglass; Jan Lodewijk de Jong; Deepak C. Sekar; Zeev Wurman
Archive | 2011
Zvi Or-Bach; Deepak C. Sekar; Brian Cronquist; Israel Beinglass; Jan Lodewijk de Jong
Archive | 2012
Zvi Or-Bach; Deepak C. Sekar; Brian Cronquist
Archive | 2013
Zvi Or-Bach; Brian Cronquist; Deepak C. Sekar
Archive | 2011
Zvi Or-Bach; Deepak C. Sekar; Brian Cronquist; Israel Beinglass; Zeev Wurman; Paul Lim
Archive | 2012
Zvi Or-Bach; Deepak C. Sekar; Brian Cronquist; Zeev Wurman
Archive | 2012
Deepak C. Sekar; Zvi Or-Bach; Brian Cronquist
Archive | 2011
Deepak C. Sekar; Zvi Or-Bach; Brian Cronquist
Archive | 2010
Zvi Or-Bach; Brian Cronquist; Israel Beinglass; Jan Lodewijk de Jong; Deepak C. Sekar
