Doyle E. Bennett

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MRS Proceedings | 1999

Thomas H. Osterheld; Steve Zuniga; Sidney P. Huey; Peter McKeever; Chad Garretson; Ben Bonner; Doyle E. Bennett; Raymond R. Jin

This paper reports a technological advancement in developing and implementing a novel retaining ring of advanced edge performance (AEP ring) for an advanced polishing head design. The AEP ring has been successfully used for significantly improved CMP performance in different CMP applications: oxide (PMD and ILD), shallow trench isolation (STI), polysilicon, metal (W and Cu), silicon-on-insulator (SOI), and silicon CMP. Robust processes have been developed using AEP ring along with many hardware upgrades for each application with extended runs to meet requirements of advanced IC device fabrication.

Archive | 1998

Boris Fishkin; Charles C. Garretson; Peter McKeever; Thomas H. Osterheld; Gopalakrishna B. Prabhu; Doyle E. Bennett; Benjamin A. Bonner; Sidney P. Huey

Archive | 1998

Brian J. Brown; Robert D. Tolles; James C. Nystrom; Doyle E. Bennett; Madhavi Chandrachood

Archive | 2003

Doyle E. Bennett; Boguslaw A. Swedek; Arulkumar Shanmugasundram

Archive | 1998

Ginetto Addiego; Doyle E. Bennett; Sen-Hou Ko; Tom Osterheld; Fred C. Redeker; アーディエゴジネット; コセン−ホウ; エドワードベネットドイル; オスターヘルドトム; シー．レデカーフレッド

Archive | 2004

Doyle E. Bennett; Jeffrey Drue David; Manoocher Birang; Jimin Zhang; Boguslaw A. Swedek

Archive | 2003

Doyle E. Bennett; Sandeep R Koppikar; Jeffrey Drue David; Boguslaw A. Swedek; Nils Johansson

china semiconductor technology international conference | 2012

Sidney P. Huey; Balaji Chandrasekaran; Doyle E. Bennett; Stan D. Tsai; Kun Xu; Jun Qian; Siva Dhandapani; Jeff David; Bogdan Swedek; Lakshmanan Karuppiah

Archive | 2000