E. Sangiorgi

Physically based modeling of low field electron mobility in ultrathin single- and double-gate SOI n-MOSFETs

In this paper, we have extensively investigated the silicon thickness dependence of the low field electron mobility in ultrathin silicon-on-insulator (UT-SOI) MOSFETs operated both in single- and in double-gate mode. A physically based model including all the scattering mechanisms that are known to be most relevant in bulk MOSFETs has been extended and applied to SOI structures. A systematic comparison with the measurements shows that the experimental mobility dependence on the silicon thickness (T/sub SI/) cannot be quantitatively explained within the transport picture that seems adequate for bulk transistors. In an attempt to improve the agreement with the experiments, we have critically rediscussed our model for the phonon scattering and developed a model for the scattering induced by the T/sub SI/ fluctuations. Our results suggest that the importance of the surface optical (SO) phonons could be significantly enhanced in UT-SOI MOSFETs with respect to bulk transistors. Furthermore, both the SO phonon and the T/sub SI/ fluctuation scattering are remarkably enhanced with reducing T/sub SI/, so that they could help explain the experimental mobility behavior.

Understanding quasi-ballistic transport in nano-MOSFETs: part I-scattering in the channel and in the drain

In this paper, and in Part II, Monte Carlo (MC) simulations including quantum corrections to the potential and calibrated scattering models are used to study electronic transport in bulk and double-gate silicon-on-insulator MOSFETs with L/sub G/ down to 14-nm designed according to the 2003 International Technology Roadmap for Semiconductors. Simulations with and without scattering are used to assess the influence of quasi-ballistic transport on the MOSFET on-current. We analyze in detail the flux of back-scattered carriers. The role of scattering in different parts of the device is clarified and the MC results are compared to simple models for quasi-ballistic transport presented in the literature.

Low field electron and hole mobility of SOI transistors fabricated on ultrathin silicon films for deep submicrometer technology application

In this paper, we present a comprehensive experimental characterization of electron and hole effective mobility (/spl mu//sub eff/) of ultrathin SOI n- and p-MOSFETs. Measurements have been performed at different temperatures using a special test structure able to circumvent parasitic resistance effects. Our results indicate that, at large inversion densities (N/sub inv/), the mobility of ultrathin SOI transistors is largely insensitive to silicon thickness (T/sub SI/) and is larger than in heavily doped bulk MOS because of a lower effective field. At small N/sub inv/, instead, mobility of SOI transistors exhibits a systematic reduction with decreasing T/sub SI/. The possible explanation for this /spl mu//sub eff/ degradation in extremely thin silicon layers is discussed by means of a comparison to previously published experimental data and theoretical calculations. Our analysis suggests a significant role is played by an enhancement of phonon scattering due to carrier confinement in the thinnest semiconductor films. The experimental mobility data have then been used to study the possible implications for ultrashort SOI transistor performance using numerical simulations.

An experimental study of mobility enhancement in ultrathin SOI transistors operated in double-gate mode

In this paper, we report an experimental investigation of electron mobility in ultrathin SOI MOSFETs operated in double-gate mode. Mobility is measured for silicon thickness down to approximately 5 nm and for different temperatures. Mobility data in single- and double-gate mode are then compared according to two different criteria imposing either the same total inversion charge density or the same effective field in the two operating modes. Our results demonstrate that for silicon films around 10 nm or thinner and at small inversion densities, a modest but unambiguous mobility improvement for double-gate mode operation is observed even if the same effective field as in the single-gate mode is kept. Furthermore, we also document that the mobility in double-gate mode can improve markedly above single-gate mobility when the comparison is made at the same total inversion density. This latter feature of the double-gate operating mode can be very beneficial in the perspective of very-low voltage operation.

Scaling the MOS transistor below 0.1 /spl mu/m: methodology, device structures, and technology requirements

This work is a systematic investigation of the feasibility of MOSFETs with a gate length below 0.1 /spl mu/m. Limits imposed on the scalability of oxide thickness and supply voltage require a new scaling methodology which allows these parameters to be maintained constant. The feasibility of achieving sub-0.1 /spl mu/m MOSFETs in this way is evaluated through simulations of the electrical characteristics of several different device structures and by addressing the most important issues related to the scaling down to ultra-short gate lengths. This study forms a valuable starting point for the understanding of technological requirements for future ULSI. >

Analysis of Self-Heating Effects in Ultrathin-Body SOI MOSFETs by Device Simulation

This paper discusses self-heating (SHE) effects in silicon-on-insulator (SOI) CMOS technology and applies device simulation to analyze the impact of thermal effects on the operation of nanoscale SOI n-MOSFETs. A 2-D drift-diffusion electrothermal simulation, using an electron transport model calibrated against Monte Carlo simulations at various temperatures, is employed in the analysis. We report the effects of device-structure parameters, such as SOI layer thickness, buried-oxide (BOX) thickness, source/drain (S/D) extension length, and thickness of the elevated S/D region, on the SHE of nanoscale MOSFETs. The SHE effects become significant due to the adoption of thin silicon layers and to the low thermal conductivity of the BOX, leading to the rise of large temperature under nominal operation conditions for high-performance digital circuits. The ac performance of SOI MOSFETs is influenced as well, and in particular, a severe degradation of the cutoff frequency of very short MOSFETs is predicted by numerical electrothermal device simulations. Although the effects of SHE on device performance are found to be somewhat modest and might be mitigated through device design, they may result in a degradation of the long-term reliability.

A many-band silicon model for hot-electron transport at high energies

Abstract A new silicon model for electron transport at high electric fields is presented. The model features an original conduction-band structure consisting of three isotropic bands together with the lowest non-parabolic band in a finite spherical Brillouin zone. The bands are given by analytic expressions whose parameters are fixed by best fitting the density of states taken from band-structure calculations. Such a model is consistently used in electron dynamics and in the evaluation of the scattering probabilities. The coupling constants to the scattering agents are determined by best fitting the available experimental data on transport properties. The effect of the new model on the results is discussed for a bulk system with particular attention to the features (e.g. the detailed shape of the electron distribution function) which are important for device applications.

A general purpose device simulator coupling Poisson and Monte Carlo transport with applications to deep submicron MOSFETs

An efficient self-consistent device simulator coupling Poisson equation and Monte Carlo transport suitable for general silicon devices, including those with regions of high doping/carrier densities, is discussed. Key features include an original iteration scheme and an almost complete vectorization of the program. The simulator has been used to characterize nonequilibrium effects in deep submicron nMOSFETs. Substantial overshoot effects are noticeable at gate lengths of 0.25 mu m at room temperatures. >

Low field mobility of ultra-thin SOI N- and P-MOSFETs: Measurements and implications on the performance of ultra-short MOSFETs

Electron and hole effective mobilities of ultra-thin SOI N- and P-MOSFETs have been measured at different temperatures using a special test structure able to circumvent parasitic resistance effects. At large inversion densities (N/sub inv/) ultra-thin SOI mobility can be higher than in heavily doped bulk MOS due a lower effective field and it is largely insensitive to silicon thickness (T/sub SI/). However, at small Ni/sub inv/ the mobility is clearly reduced for decreasing T/sub SI/. The effective mobility data are used to study the implications for ultra-short MOS transistor performance at device simulation level.

Simple and efficient modeling of EPROM writing

A simple and efficient model for first-order simulation of the writing of n-channel erasable programmable ROM (EPROM) cells is presented. It allows the current injected into the gate insulator of the cell transistor to be calculated, accounting (at first order) both for the nonMaxwellian form of the electron energy distribution and for the nonlocal nature of carrier heating. The model is implemented as a postprocessor of a two-dimensional device simulator, and it is validated by means of a comparison with experimental data obtained with devices with effective channel lengths ranging from 1.4 to 0.5 mu m. >